Abstract
The micromechanical behavior of single-crystal Cu6Sn5 was studied by microcompression testing of pillars. The pillars were fabricated by focused ion beam milling and tested using a nanoindenter with a flat tip. The stress-strain behavior and fractographic analysis show that Cu6Sn5 deforms elastically and undergoes cleavage, resulting in fracture. The strain bursts on stress-strain curves correspond to cleavage on various planes. The fracture stress calculated using the area at the top of pillars was independent of taper angle.
Original language | English (US) |
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Pages (from-to) | 480-483 |
Number of pages | 4 |
Journal | Scripta Materialia |
Volume | 63 |
Issue number | 5 |
DOIs | |
State | Published - Sep 1 2010 |
Keywords
- CuSn
- Focused ion beam
- Lead-free solder
- Micropillar compression
ASJC Scopus subject areas
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
- Metals and Alloys