Mechanical problems of manufacturing processes for photovoltaic modules

S. Wiese, F. Kraemer, Rico MEIER, S. Schindler

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The paper describes thermo-mechanical problems of the soldering process, which is used to interconnect single solar cells with each other, in order to create a photovoltaic module. The interconnection wires need to conduct high currents, because of the demands for high power modules that operate at low voltages. Therefore the resistance of the wiring is a very critical factor, because it influences strongly the total module efficiency. However significant mechanical problems are created by increasing the width and height of the rectangular wires, because the brittle silicon solar cells are prone to breakage. Therefore innovations in interconnection design are necessary to release mechanical stresses during the assembly process.

Original languageEnglish (US)
Title of host publicationEMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings
StatePublished - Dec 1 2011
Externally publishedYes
Event18th European Microelectronics and Packaging Conference, EMPC-2011 - Brighton, United Kingdom
Duration: Sep 12 2011Sep 15 2011

Other

Other18th European Microelectronics and Packaging Conference, EMPC-2011
CountryUnited Kingdom
CityBrighton
Period9/12/119/15/11

Fingerprint

Wire
Silicon solar cells
Soldering
Electric wiring
Solar cells
Innovation
Electric potential

Keywords

  • Cell String
  • Copper Ribbon
  • Mechanical Stresses
  • Photovoltaic Modules
  • Reliability

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Wiese, S., Kraemer, F., MEIER, R., & Schindler, S. (2011). Mechanical problems of manufacturing processes for photovoltaic modules. In EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings [6142427]

Mechanical problems of manufacturing processes for photovoltaic modules. / Wiese, S.; Kraemer, F.; MEIER, Rico; Schindler, S.

EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings. 2011. 6142427.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Wiese, S, Kraemer, F, MEIER, R & Schindler, S 2011, Mechanical problems of manufacturing processes for photovoltaic modules. in EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings., 6142427, 18th European Microelectronics and Packaging Conference, EMPC-2011, Brighton, United Kingdom, 9/12/11.
Wiese S, Kraemer F, MEIER R, Schindler S. Mechanical problems of manufacturing processes for photovoltaic modules. In EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings. 2011. 6142427
Wiese, S. ; Kraemer, F. ; MEIER, Rico ; Schindler, S. / Mechanical problems of manufacturing processes for photovoltaic modules. EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings. 2011.
@inproceedings{a09604c674be4ffe9cfbcee1029e3c08,
title = "Mechanical problems of manufacturing processes for photovoltaic modules",
abstract = "The paper describes thermo-mechanical problems of the soldering process, which is used to interconnect single solar cells with each other, in order to create a photovoltaic module. The interconnection wires need to conduct high currents, because of the demands for high power modules that operate at low voltages. Therefore the resistance of the wiring is a very critical factor, because it influences strongly the total module efficiency. However significant mechanical problems are created by increasing the width and height of the rectangular wires, because the brittle silicon solar cells are prone to breakage. Therefore innovations in interconnection design are necessary to release mechanical stresses during the assembly process.",
keywords = "Cell String, Copper Ribbon, Mechanical Stresses, Photovoltaic Modules, Reliability",
author = "S. Wiese and F. Kraemer and Rico MEIER and S. Schindler",
year = "2011",
month = "12",
day = "1",
language = "English (US)",
isbn = "9780956808608",
booktitle = "EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings",

}

TY - GEN

T1 - Mechanical problems of manufacturing processes for photovoltaic modules

AU - Wiese, S.

AU - Kraemer, F.

AU - MEIER, Rico

AU - Schindler, S.

PY - 2011/12/1

Y1 - 2011/12/1

N2 - The paper describes thermo-mechanical problems of the soldering process, which is used to interconnect single solar cells with each other, in order to create a photovoltaic module. The interconnection wires need to conduct high currents, because of the demands for high power modules that operate at low voltages. Therefore the resistance of the wiring is a very critical factor, because it influences strongly the total module efficiency. However significant mechanical problems are created by increasing the width and height of the rectangular wires, because the brittle silicon solar cells are prone to breakage. Therefore innovations in interconnection design are necessary to release mechanical stresses during the assembly process.

AB - The paper describes thermo-mechanical problems of the soldering process, which is used to interconnect single solar cells with each other, in order to create a photovoltaic module. The interconnection wires need to conduct high currents, because of the demands for high power modules that operate at low voltages. Therefore the resistance of the wiring is a very critical factor, because it influences strongly the total module efficiency. However significant mechanical problems are created by increasing the width and height of the rectangular wires, because the brittle silicon solar cells are prone to breakage. Therefore innovations in interconnection design are necessary to release mechanical stresses during the assembly process.

KW - Cell String

KW - Copper Ribbon

KW - Mechanical Stresses

KW - Photovoltaic Modules

KW - Reliability

UR - http://www.scopus.com/inward/record.url?scp=84857579411&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84857579411&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:84857579411

SN - 9780956808608

BT - EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings

ER -