Mechanical integrity of a carbon nanotube/copper-based through-silicon via for 3D integrated circuits: A multi-scale modeling approach

Engineering & Materials Science

• Three dimensional integrated circuits 100%
• Carbon nanotubes 75%
• Copper 58%
• Silicon 56%
• Molecular dynamics 40%
• Computer simulation 39%
• Adhesion 32%
• Plastic deformation 31%
• Electromigration 23%
• Composite materials 20%
• Thermal cycling 20%
• Electric properties 19%
• Microelectronics 19%
• Mechanical properties 11%
• Finite element method 11%

Medicine & Life Sciences

• Carbon Nanotubes 97%
• Silicon 87%
• Copper 72%
• Molecular Dynamics Simulation 40%
• Plastics 34%
• Miniaturization 25%
• Finite Element Analysis 22%
• Hot Temperature 13%

Chemical Compounds

• Carbon Nanotube 52%
• Plastic Deformation 44%
• Molecular Dynamics 26%
• Thermal Cycling 22%
• Simulation 22%
• Microelectronics 20%
• Composite Material 17%
• Electrical Property 15%