Mechanical characterization of lead-free Sn-Ag-Cu solder joints by high-temperature nanoindentation

S. Lotfian, J. M. Molina-Aldareguia, K. E. Yazzie, J. Llorca, Nikhilesh Chawla

Research output: Contribution to journalArticle

28 Citations (Scopus)

Abstract

The reliability of Pb-free solder joints is controlled by their microstructural constituents. Therefore, knowledge of the solder microconstituents' mechanical properties as a function of temperature is required. Sn-Ag-Cu lead-free solder alloy contains three phases: a Sn-rich phase, and the intermetallic compounds (IMCs) Cu6Sn5 and Ag3Sn. Typically, the Sn-rich phase is surrounded by a eutectic mixture of β-Sn, Cu6Sn5, and Ag3Sn. In this paper, we report on the Young's modulus and hardness of the Cu 6Sn5 and Cu3Sn IMCs, the β-Sn phase, and the eutectic compound, as measured by nanoindentation at elevated temperatures. For both the β-Sn phase and the eutectic compound, the hardness and Young's modulus exhibited strong temperature dependence. In the case of the intermetallics, this temperature dependence is observed for Cu 6Sn5, but the mechanical properties of Cu3Sn are more stable up to 200 C.

Original languageEnglish (US)
Pages (from-to)1085-1091
Number of pages7
JournalJournal of Electronic Materials
Volume42
Issue number6
DOIs
StatePublished - Jun 2013

Fingerprint

Nanoindentation
solders
nanoindentation
eutectics
Soldering alloys
intermetallics
Lead
Eutectics
Intermetallics
modulus of elasticity
hardness
mechanical properties
temperature dependence
Elastic moduli
Hardness
Mechanical properties
Temperature
temperature
Lead-free solders

Keywords

  • High-temperature nanoindentation
  • intermetallics
  • lead-free solder
  • Sn-Ag-Cu solder

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Materials Chemistry

Cite this

Mechanical characterization of lead-free Sn-Ag-Cu solder joints by high-temperature nanoindentation. / Lotfian, S.; Molina-Aldareguia, J. M.; Yazzie, K. E.; Llorca, J.; Chawla, Nikhilesh.

In: Journal of Electronic Materials, Vol. 42, No. 6, 06.2013, p. 1085-1091.

Research output: Contribution to journalArticle

Lotfian, S. ; Molina-Aldareguia, J. M. ; Yazzie, K. E. ; Llorca, J. ; Chawla, Nikhilesh. / Mechanical characterization of lead-free Sn-Ag-Cu solder joints by high-temperature nanoindentation. In: Journal of Electronic Materials. 2013 ; Vol. 42, No. 6. pp. 1085-1091.
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