Mechanical behaviour and fatigue of copper ribbons used as solar cell interconnectors

Steffen Wiese, Rico Meier, Frank Kraemer

Research output: Chapter in Book/Report/Conference proceedingConference contribution

25 Scopus citations

Abstract

The soldering of solar cell strings is a critical step in the production of photovoltaic modules. Temperature induced stresses can cause cracking in the cells. During the soldering operation, the cell and the wires are heat up and expand. During the subsequent cooling phase they contract. The differential contraction between the Cu and the Si combined with thermal gradients, causes mechanical stress in the assembly. Moreover the lifetime of solar modules can be limited by the fatigue of the copper-ribbons. Since the front glass and the silicon cells have a significant difference in their coefficients of thermal expansion, temperature fluctuations are able to induce thermo-mechanical stresses in the photovoltaic module. The paper will present the results of the mechanical tests on copper materials. In order to give an explanation for the fatigue behaviour of the material, a correlation to the relevant microstructures will be given. Based on the investigated mechanical behaviour practical implications for proper handling of copper ribbons during solar module production processes will be concluded.

Original languageEnglish (US)
Title of host publication2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010
DOIs
StatePublished - Jun 24 2010
Externally publishedYes
Event2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010 - Bordeaux, France
Duration: Apr 26 2010Apr 28 2010

Publication series

Name2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010

Other

Other2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010
Country/TerritoryFrance
CityBordeaux
Period4/26/104/28/10

ASJC Scopus subject areas

  • Computational Theory and Mathematics
  • Electrical and Electronic Engineering
  • Theoretical Computer Science

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