@inproceedings{b1a7ff1b9d5d4eefa21c259e867af251,
title = "Measurement uncertainty propagation in the validation of high-speed interconnects",
abstract = "Validating the performance of high-speed interconnect modeling against measurements of fabricated test structures requires an understanding of the robustness of the measurement methods as well as the physical variations present in an imperfectly fabricated test structure. This paper presents a methodology for evaluating the performance of interconnect modeling considering the actual metrology variation and the realworld manufacturing tolerances used to fabricate the test vehicle. By ensuring that measurement results, inclusive of operator and equipment variations, overlap the modeling inclusive of expected manufacturing variations, confidence in the high-speed interconnect modeling is established. ",
keywords = "Correlation, Manufacturing variations, Measurement uncertainty, Reproducibility",
author = "Geyik, {Cemil S.} and Hill, {Michael J.} and Zhichao Zhang and Kemal Aygun and Aberle, {James T.}",
note = "Publisher Copyright: {\textcopyright} 2020 IEEE.; 29th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2020 ; Conference date: 05-10-2020 Through 07-10-2020",
year = "2020",
month = oct,
doi = "10.1109/EPEPS48591.2020.9231369",
language = "English (US)",
series = "EPEPS 2020 - IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "EPEPS 2020 - IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems",
}