Measurement uncertainty propagation in the validation of high-speed interconnects

Cemil S. Geyik, Michael J. Hill, Zhichao Zhang, Kemal Aygun, James T. Aberle

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

Validating the performance of high-speed interconnect modeling against measurements of fabricated test structures requires an understanding of the robustness of the measurement methods as well as the physical variations present in an imperfectly fabricated test structure. This paper presents a methodology for evaluating the performance of interconnect modeling considering the actual metrology variation and the realworld manufacturing tolerances used to fabricate the test vehicle. By ensuring that measurement results, inclusive of operator and equipment variations, overlap the modeling inclusive of expected manufacturing variations, confidence in the high-speed interconnect modeling is established.

Original languageEnglish (US)
Title of host publicationEPEPS 2020 - IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728161617
DOIs
StatePublished - Oct 2020
Externally publishedYes
Event29th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2020 - San Jose, United States
Duration: Oct 5 2020Oct 7 2020

Publication series

NameEPEPS 2020 - IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems

Conference

Conference29th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2020
Country/TerritoryUnited States
CitySan Jose
Period10/5/2010/7/20

Keywords

  • Correlation
  • Manufacturing variations
  • Measurement uncertainty
  • Reproducibility

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Energy Engineering and Power Technology

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