Measurement and prediction of Young's modulus of a Pb-free solder

Nikhilesh Chawla; F. Ochoa; V. V. Ganesh; X. Deng; M. Koopman; K. K. Chawla; S. Scarritt

doi:10.1023/B:JMSE.0000025683.19987.b3

Measurement and prediction of Young's modulus of a Pb-free solder

Nikhilesh Chawla, F. Ochoa, V. V. Ganesh, X. Deng, M. Koopman, K. K. Chawla, S. Scarritt

Chemical Engineering

Research output: Contribution to journal › Article › peer-review

37 Scopus citations

Abstract

Accurate and reproducible measurements of the Young's modulus of solders are complicated by the early onset of yielding, microporosity, and variations in cooling rate. In this study, we report measurements of Young's modulus of an Sn-3.5 wt % Ag solder by two techniques: (a) loading-unloading measurements in tension, and (b) non-destructive resonant ultrasound spectroscopy. Both techniques yielded similar values of Young's modulus. The modulus decreased with increasing microporosity, in accordance with predicted values. Cooling rate affected the Ag₃Sn intermetallic morphology, but not Young's modulus since the distribution of the particles was relatively random. This result was confirmed by microstructure-based finite element modeling.

Original language	English (US)
Pages (from-to)	385-388
Number of pages	4
Journal	Journal of Materials Science: Materials in Electronics
Volume	15
Issue number	6
DOIs	https://doi.org/10.1023/B:JMSE.0000025683.19987.b3
State	Published - Jun 2004

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Condensed Matter Physics
Electrical and Electronic Engineering

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10.1023/B:JMSE.0000025683.19987.b3

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title = "Measurement and prediction of Young's modulus of a Pb-free solder",

abstract = "Accurate and reproducible measurements of the Young's modulus of solders are complicated by the early onset of yielding, microporosity, and variations in cooling rate. In this study, we report measurements of Young's modulus of an Sn-3.5 wt % Ag solder by two techniques: (a) loading-unloading measurements in tension, and (b) non-destructive resonant ultrasound spectroscopy. Both techniques yielded similar values of Young's modulus. The modulus decreased with increasing microporosity, in accordance with predicted values. Cooling rate affected the Ag3Sn intermetallic morphology, but not Young's modulus since the distribution of the particles was relatively random. This result was confirmed by microstructure-based finite element modeling.",

author = "Nikhilesh Chawla and F. Ochoa and Ganesh, {V. V.} and X. Deng and M. Koopman and Chawla, {K. K.} and S. Scarritt",

note = "Funding Information: This research was supported by the National Science Foundation, contract #DMR-0092530 (Program Managers: K. L. Murty and B. Macdonald). We are also grateful to Indium Corporation for providing the solder ingots used in this study.",

year = "2004",

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doi = "10.1023/B:JMSE.0000025683.19987.b3",

language = "English (US)",

volume = "15",

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journal = "Journal of Materials Science: Materials in Electronics",

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T1 - Measurement and prediction of Young's modulus of a Pb-free solder

AU - Chawla, Nikhilesh

AU - Ochoa, F.

AU - Ganesh, V. V.

AU - Deng, X.

AU - Koopman, M.

AU - Chawla, K. K.

AU - Scarritt, S.

N1 - Funding Information: This research was supported by the National Science Foundation, contract #DMR-0092530 (Program Managers: K. L. Murty and B. Macdonald). We are also grateful to Indium Corporation for providing the solder ingots used in this study.

PY - 2004/6

Y1 - 2004/6

N2 - Accurate and reproducible measurements of the Young's modulus of solders are complicated by the early onset of yielding, microporosity, and variations in cooling rate. In this study, we report measurements of Young's modulus of an Sn-3.5 wt % Ag solder by two techniques: (a) loading-unloading measurements in tension, and (b) non-destructive resonant ultrasound spectroscopy. Both techniques yielded similar values of Young's modulus. The modulus decreased with increasing microporosity, in accordance with predicted values. Cooling rate affected the Ag3Sn intermetallic morphology, but not Young's modulus since the distribution of the particles was relatively random. This result was confirmed by microstructure-based finite element modeling.

AB - Accurate and reproducible measurements of the Young's modulus of solders are complicated by the early onset of yielding, microporosity, and variations in cooling rate. In this study, we report measurements of Young's modulus of an Sn-3.5 wt % Ag solder by two techniques: (a) loading-unloading measurements in tension, and (b) non-destructive resonant ultrasound spectroscopy. Both techniques yielded similar values of Young's modulus. The modulus decreased with increasing microporosity, in accordance with predicted values. Cooling rate affected the Ag3Sn intermetallic morphology, but not Young's modulus since the distribution of the particles was relatively random. This result was confirmed by microstructure-based finite element modeling.

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JO - Journal of Materials Science: Materials in Electronics

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Measurement and prediction of Young's modulus of a Pb-free solder

Abstract

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