Measurement and prediction of the contact conductance across epoxied copper contacts at cryogenic temperatures

Lisa De Beilis, Patrick E. Phelan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Literature has demonstrated that the investigation of the contact conductance (hc) across epoxied joints at cryogenic temperatures is important to the microelectronic, satellite and other space industries. The accurate theoretical prediction of the hc arising across a metalepoxy interface is still being researched. Several researchers have shown that the acoustic mismatch and other theories do not agree well with experimental data This paper presents the results of an experimental and theoretical investigation of the hc across copper/epoxy/copper contacts. From the hc data, it was possible to extract the thermal conductivity (k) of the epoxy and the thermal boundary resistance (RB) between the epoxy and copper. The Rbextracted from the experimental data was compared to model predictions made by the Acoustic Mismatch Model (AMM) and the Scattering Mediated Acoustic Mismatch Model (SMAMM). In the case of the AMM, the predictions underestimated the experimental values significantly. This finding is consistent with many investigations to date. The SMAMM was able to predict the experimental data very well when using an extremely small scattering time of 5xl0-18s.

Original languageEnglish (US)
Title of host publicationHeat Transfer
Subtitle of host publicationVolume 1
PublisherAmerican Society of Mechanical Engineers (ASME)
Pages221-227
Number of pages7
ISBN (Electronic)9780791826591
DOIs
StatePublished - 2000
EventASME 2000 International Mechanical Engineering Congress and Exposition, IMECE 2000 - Orlando, United States
Duration: Nov 5 2000Nov 10 2000

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
Volume2000-S

Conference

ConferenceASME 2000 International Mechanical Engineering Congress and Exposition, IMECE 2000
Country/TerritoryUnited States
CityOrlando
Period11/5/0011/10/00

ASJC Scopus subject areas

  • Mechanical Engineering

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