TY - GEN
T1 - Measurement and prediction of the contact conductance across epoxied copper contacts at cryogenic temperatures
AU - Beilis, Lisa De
AU - Phelan, Patrick E.
N1 - Funding Information:
P.E.P. gratefully acknowledges the support of the National Science Foundation through a CAREER Award (grant No. CTS-9696003).
Publisher Copyright:
© 2000 American Society of Mechanical Engineers (ASME). All rights reserved.
PY - 2000
Y1 - 2000
N2 - Literature has demonstrated that the investigation of the contact conductance (hc) across epoxied joints at cryogenic temperatures is important to the microelectronic, satellite and other space industries. The accurate theoretical prediction of the hc arising across a metalepoxy interface is still being researched. Several researchers have shown that the acoustic mismatch and other theories do not agree well with experimental data This paper presents the results of an experimental and theoretical investigation of the hc across copper/epoxy/copper contacts. From the hc data, it was possible to extract the thermal conductivity (k) of the epoxy and the thermal boundary resistance (RB) between the epoxy and copper. The Rbextracted from the experimental data was compared to model predictions made by the Acoustic Mismatch Model (AMM) and the Scattering Mediated Acoustic Mismatch Model (SMAMM). In the case of the AMM, the predictions underestimated the experimental values significantly. This finding is consistent with many investigations to date. The SMAMM was able to predict the experimental data very well when using an extremely small scattering time of 5xl0-18s.
AB - Literature has demonstrated that the investigation of the contact conductance (hc) across epoxied joints at cryogenic temperatures is important to the microelectronic, satellite and other space industries. The accurate theoretical prediction of the hc arising across a metalepoxy interface is still being researched. Several researchers have shown that the acoustic mismatch and other theories do not agree well with experimental data This paper presents the results of an experimental and theoretical investigation of the hc across copper/epoxy/copper contacts. From the hc data, it was possible to extract the thermal conductivity (k) of the epoxy and the thermal boundary resistance (RB) between the epoxy and copper. The Rbextracted from the experimental data was compared to model predictions made by the Acoustic Mismatch Model (AMM) and the Scattering Mediated Acoustic Mismatch Model (SMAMM). In the case of the AMM, the predictions underestimated the experimental values significantly. This finding is consistent with many investigations to date. The SMAMM was able to predict the experimental data very well when using an extremely small scattering time of 5xl0-18s.
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U2 - 10.1115/IMECE2000-1386
DO - 10.1115/IMECE2000-1386
M3 - Conference contribution
AN - SCOPUS:85119678591
T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
SP - 221
EP - 227
BT - Heat Transfer
PB - American Society of Mechanical Engineers (ASME)
T2 - ASME 2000 International Mechanical Engineering Congress and Exposition, IMECE 2000
Y2 - 5 November 2000 through 10 November 2000
ER -