Low temperature integration of hybrid CMOS devices on plastic substrates

S. Gowrisanker, M. A. Quevedo-Lopez, H. N. Alshareef, B. Gnade, S. Venugopal, R. Krishna, K. Kaftanoglu, David Allee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

The development of flexible Complimentary Metal-Oxide-Semiconductor (CMOS) circuits reduces power consumption by ∼50x compared to n-type (or p-type) only thin film transistor (TFT) digital circuits. In this work we demonstrate a new integration approach to fabricate CMOS circuits on plastic substrates (Poly-ethylene naphthalene, PEN). We use pentacene and amorphous silicon (a-Si:H) thin film transistors for p-type and n-type devices, respectively. The maximum processing temperature for n-type TFTs is 180°C and 120°C for the p-type TFTs. CMOS circuits demonstrated include inverters, NAND and NOR gates. nMOS and pMOS carrier mobility achieved after the CMOS integration process flow are 1.0 and 0.05 cm2/V-s, respectively. Threshold voltages (Vt) are 3.89V for nMOS and -1.89V for pMOS. The voltage transfer curve of the CMOS inverter showed a gain of 16. Correct logic operation of integrated flexible NAND and NOR CMOS gates are reported.

Original languageEnglish (US)
Title of host publication2009 Flexible Electronics and Displays Conference and Exhibition, FLEX 2009
DOIs
StatePublished - 2009
EventFlexible Electronics and Displays Conference and Exhibition, FLEX 2009 -
Duration: Feb 2 2009Feb 2 2009

Other

OtherFlexible Electronics and Displays Conference and Exhibition, FLEX 2009
Period2/2/092/2/09

Fingerprint

MOS devices
Plastics
Substrates
Metals
Thin film transistors
Temperature
Networks (circuits)
Carrier mobility
Digital circuits
Naphthalene
Amorphous silicon
Threshold voltage
Oxide semiconductors
Ethylene
Electric power utilization
Electric potential
Processing

Keywords

  • Flexible electronics
  • Hybrid CMOS
  • NAND gate
  • NOR gate

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Gowrisanker, S., Quevedo-Lopez, M. A., Alshareef, H. N., Gnade, B., Venugopal, S., Krishna, R., ... Allee, D. (2009). Low temperature integration of hybrid CMOS devices on plastic substrates. In 2009 Flexible Electronics and Displays Conference and Exhibition, FLEX 2009 [5069280] https://doi.org/10.1109/FEDC.2009.5069280

Low temperature integration of hybrid CMOS devices on plastic substrates. / Gowrisanker, S.; Quevedo-Lopez, M. A.; Alshareef, H. N.; Gnade, B.; Venugopal, S.; Krishna, R.; Kaftanoglu, K.; Allee, David.

2009 Flexible Electronics and Displays Conference and Exhibition, FLEX 2009. 2009. 5069280.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Gowrisanker, S, Quevedo-Lopez, MA, Alshareef, HN, Gnade, B, Venugopal, S, Krishna, R, Kaftanoglu, K & Allee, D 2009, Low temperature integration of hybrid CMOS devices on plastic substrates. in 2009 Flexible Electronics and Displays Conference and Exhibition, FLEX 2009., 5069280, Flexible Electronics and Displays Conference and Exhibition, FLEX 2009, 2/2/09. https://doi.org/10.1109/FEDC.2009.5069280
Gowrisanker S, Quevedo-Lopez MA, Alshareef HN, Gnade B, Venugopal S, Krishna R et al. Low temperature integration of hybrid CMOS devices on plastic substrates. In 2009 Flexible Electronics and Displays Conference and Exhibition, FLEX 2009. 2009. 5069280 https://doi.org/10.1109/FEDC.2009.5069280
Gowrisanker, S. ; Quevedo-Lopez, M. A. ; Alshareef, H. N. ; Gnade, B. ; Venugopal, S. ; Krishna, R. ; Kaftanoglu, K. ; Allee, David. / Low temperature integration of hybrid CMOS devices on plastic substrates. 2009 Flexible Electronics and Displays Conference and Exhibition, FLEX 2009. 2009.
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