Low-temperature amorphous-silicon backplane technology development for flexible displays in a manufacturing pilot-line environment

Gregory Raupp; Shawn M. O'Rourke; Curt Moyer; Barry P. O'Brien; Scott K. Ageno; Douglas E. Loy; Edward J. Bawolek; David Allee; Sameer M. Venugopal; Jann Kaminski; Dirk Bottesch; Jeff Dailey; Ke Long; Michael Marrs; Nick R. Munizza; Hanna Haverinen; Nicholas Colaneri

doi:10.1889/1.2759549

Low-temperature amorphous-silicon backplane technology development for flexible displays in a manufacturing pilot-line environment

Gregory Raupp, Shawn M. O'Rourke, Curt Moyer, Barry P. O'Brien, Scott K. Ageno, Douglas E. Loy, Edward J. Bawolek, David Allee, Sameer M. Venugopal, Jann Kaminski, Dirk Bottesch, Jeff Dailey, Ke Long, Michael Marrs, Nick R. Munizza, Hanna Haverinen, Nicholas Colaneri

Research output: Contribution to journal › Article › peer-review

52 Scopus citations

Abstract

A low-temperature amorphous-silicon (a-Si:H) thin-film-transistor (TFT) backplane technology for high-information-content flexible displays has been developed. Backplanes were integrated with frontplane technologies to produce high-performance active-matrix reflective electrophoretic ink, reflective cholesteric liquid crystal and emissive OLED flexible-display technology demonstrators (TDs). Backplanes up to 4 in. on the diagonal have been fabricated on a 6-in. wafer-scale pilot line. The critical steps in the evolution of backplane technology, from qualification of baseline low-temperature (180°C) a-Si:H process on the 6-in. line with rigid substrates, to transferring the process to flexible plastic and flexible stainless-steel substrates, to form factor scale-up of the TFT arrays, and finally manufacturing scale-up to a Gen 2 (370 × 470 mm) display-scale pilot line, will be reviewed.

Original language	English (US)
Pages (from-to)	445-454
Number of pages	10
Journal	Journal of the Society for Information Display
Volume	15
Issue number	7
DOIs	https://doi.org/10.1889/1.2759549
State	Published - Jul 2007

Keywords

Amorphous silicon
Backplane electronics
Flexible displays
Pilot-line manufacturing
Thin-film transistors

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Electrical and Electronic Engineering

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10.1889/1.2759549

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Raupp, G., O'Rourke, S. M., Moyer, C., O'Brien, B. P., Ageno, S. K., Loy, D. E., Bawolek, E. J., Allee, D., Venugopal, S. M., Kaminski, J., Bottesch, D., Dailey, J., Long, K., Marrs, M., Munizza, N. R., Haverinen, H., & Colaneri, N. (2007). Low-temperature amorphous-silicon backplane technology development for flexible displays in a manufacturing pilot-line environment. Journal of the Society for Information Display, 15(7), 445-454. https://doi.org/10.1889/1.2759549

Raupp, G, O'Rourke, SM, Moyer, C, O'Brien, BP, Ageno, SK, Loy, DE, Bawolek, EJ, Allee, D, Venugopal, SM, Kaminski, J, Bottesch, D, Dailey, J, Long, K, Marrs, M, Munizza, NR, Haverinen, H & Colaneri, N 2007, 'Low-temperature amorphous-silicon backplane technology development for flexible displays in a manufacturing pilot-line environment', Journal of the Society for Information Display, vol. 15, no. 7, pp. 445-454. https://doi.org/10.1889/1.2759549

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abstract = "A low-temperature amorphous-silicon (a-Si:H) thin-film-transistor (TFT) backplane technology for high-information-content flexible displays has been developed. Backplanes were integrated with frontplane technologies to produce high-performance active-matrix reflective electrophoretic ink, reflective cholesteric liquid crystal and emissive OLED flexible-display technology demonstrators (TDs). Backplanes up to 4 in. on the diagonal have been fabricated on a 6-in. wafer-scale pilot line. The critical steps in the evolution of backplane technology, from qualification of baseline low-temperature (180°C) a-Si:H process on the 6-in. line with rigid substrates, to transferring the process to flexible plastic and flexible stainless-steel substrates, to form factor scale-up of the TFT arrays, and finally manufacturing scale-up to a Gen 2 (370 × 470 mm) display-scale pilot line, will be reviewed.",

keywords = "Amorphous silicon, Backplane electronics, Flexible displays, Pilot-line manufacturing, Thin-film transistors",

author = "Gregory Raupp and O'Rourke, {Shawn M.} and Curt Moyer and O'Brien, {Barry P.} and Ageno, {Scott K.} and Loy, {Douglas E.} and Bawolek, {Edward J.} and David Allee and Venugopal, {Sameer M.} and Jann Kaminski and Dirk Bottesch and Jeff Dailey and Ke Long and Michael Marrs and Munizza, {Nick R.} and Hanna Haverinen and Nicholas Colaneri",

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AU - Colaneri, Nicholas

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Low-temperature amorphous-silicon backplane technology development for flexible displays in a manufacturing pilot-line environment

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