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Low Temperature ( 25 - 200 C) Wafer Bonding Wet via a cross-bonding nano-interphase (SILOXSI) for biomedical and device applications.
Robert Culbertson
(Inventor)
Arizona State University
Research output
:
Patent
Overview
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Dive into the research topics of 'Low Temperature ( 25 - 200 C) Wafer Bonding Wet via a cross-bonding nano-interphase (SILOXSI) for biomedical and device applications.'. Together they form a unique fingerprint.
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Physics & Astronomy
wafers
100%
directories
76%
semiconductor devices
45%
hardware
42%
fabrication
40%
chemical composition
39%
medical electronics
38%
sputtering
34%
etching
33%
ovens
26%
vacuum systems
26%
footprints
25%
room temperature
24%
drugs
22%
central processing units
22%
optoelectronic devices
22%
carbides
21%
silicates
21%
delivery
21%
nitrides
20%
industries
18%
manufacturing
18%
sintering
17%
costs
16%
nucleation
16%
synthesis
16%
requirements
15%
ceramics
14%
vacuum
14%
sensors
13%
annealing
13%
glass
12%
electronics
11%