Abstract
This paper reports the design and analysis of a generic thermal isolation platform that can support a variety of MEMS devices and isolate them from the environment. The platform provides high thermal isolation from the environment by employing long meandering and hollow support metal beams. This isolation is needed for low-power (<10mW) micro oven-controlled constant-temperature operation over a -50∼70 °C temperature range. These beams also provide mechanical support. Optimal selection of the thermal and mechanical characteristics of these beams depends on many factors including beam materials, shape and structure, and the number of electrical signals. Metal-only, meandering and hollow beams provide the highest thermal isolation and mechanical stiffness. The combination of the isolation platform batch fabrication process and wafer-level instrument transfer/assembly onto the platform enables its broad and cost-effective application.
| Original language | English (US) |
|---|---|
| Title of host publication | Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS) |
| Pages | 532-535 |
| Number of pages | 4 |
| State | Published - 2005 |
| Externally published | Yes |
| Event | 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami - Miami Beach, FL, United States Duration: Jan 30 2005 → Feb 3 2005 |
Other
| Other | 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami |
|---|---|
| Country | United States |
| City | Miami Beach, FL |
| Period | 1/30/05 → 2/3/05 |
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Keywords
- Platform
- Thermal isolation
- Wafer bonding
ASJC Scopus subject areas
- Mechanical Engineering
- Electrical and Electronic Engineering
- Control and Systems Engineering
Cite this
Low-power thermal isolation for environmentally resistant microinstruments. / Lee, Sang Hyun; Chae, Junseok; Yoon, Sangwon; Yazdi, Navid; Najafi, Khalil.
Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). 2005. p. 532-535 TPb27.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Low-power thermal isolation for environmentally resistant microinstruments
AU - Lee, Sang Hyun
AU - Chae, Junseok
AU - Yoon, Sangwon
AU - Yazdi, Navid
AU - Najafi, Khalil
PY - 2005
Y1 - 2005
N2 - This paper reports the design and analysis of a generic thermal isolation platform that can support a variety of MEMS devices and isolate them from the environment. The platform provides high thermal isolation from the environment by employing long meandering and hollow support metal beams. This isolation is needed for low-power (<10mW) micro oven-controlled constant-temperature operation over a -50∼70 °C temperature range. These beams also provide mechanical support. Optimal selection of the thermal and mechanical characteristics of these beams depends on many factors including beam materials, shape and structure, and the number of electrical signals. Metal-only, meandering and hollow beams provide the highest thermal isolation and mechanical stiffness. The combination of the isolation platform batch fabrication process and wafer-level instrument transfer/assembly onto the platform enables its broad and cost-effective application.
AB - This paper reports the design and analysis of a generic thermal isolation platform that can support a variety of MEMS devices and isolate them from the environment. The platform provides high thermal isolation from the environment by employing long meandering and hollow support metal beams. This isolation is needed for low-power (<10mW) micro oven-controlled constant-temperature operation over a -50∼70 °C temperature range. These beams also provide mechanical support. Optimal selection of the thermal and mechanical characteristics of these beams depends on many factors including beam materials, shape and structure, and the number of electrical signals. Metal-only, meandering and hollow beams provide the highest thermal isolation and mechanical stiffness. The combination of the isolation platform batch fabrication process and wafer-level instrument transfer/assembly onto the platform enables its broad and cost-effective application.
KW - Platform
KW - Thermal isolation
KW - Wafer bonding
UR - http://www.scopus.com/inward/record.url?scp=26844564119&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=26844564119&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:26844564119
SP - 532
EP - 535
BT - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ER -