Low-power thermal isolation for environmentally resistant microinstruments

Sang Hyun Lee, Junseok Chae, Sangwon Yoon, Navid Yazdi, Khalil Najafi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

This paper reports the design and analysis of a generic thermal isolation platform that can support a variety of MEMS devices and isolate them from the environment. The platform provides high thermal isolation from the environment by employing long meandering and hollow support metal beams. This isolation is needed for low-power (<10mW) micro oven-controlled constant-temperature operation over a -50∼70 °C temperature range. These beams also provide mechanical support. Optimal selection of the thermal and mechanical characteristics of these beams depends on many factors including beam materials, shape and structure, and the number of electrical signals. Metal-only, meandering and hollow beams provide the highest thermal isolation and mechanical stiffness. The combination of the isolation platform batch fabrication process and wafer-level instrument transfer/assembly onto the platform enables its broad and cost-effective application.

Original languageEnglish (US)
Title of host publicationProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Pages532-535
Number of pages4
StatePublished - 2005
Externally publishedYes
Event18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami - Miami Beach, FL, United States
Duration: Jan 30 2005Feb 3 2005

Other

Other18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami
CountryUnited States
CityMiami Beach, FL
Period1/30/052/3/05

Fingerprint

Ovens
Metals
MEMS
Stiffness
Fabrication
Temperature
Hot Temperature
Costs

Keywords

  • Platform
  • Thermal isolation
  • Wafer bonding

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering
  • Control and Systems Engineering

Cite this

Lee, S. H., Chae, J., Yoon, S., Yazdi, N., & Najafi, K. (2005). Low-power thermal isolation for environmentally resistant microinstruments. In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS) (pp. 532-535). [TPb27]

Low-power thermal isolation for environmentally resistant microinstruments. / Lee, Sang Hyun; Chae, Junseok; Yoon, Sangwon; Yazdi, Navid; Najafi, Khalil.

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). 2005. p. 532-535 TPb27.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Lee, SH, Chae, J, Yoon, S, Yazdi, N & Najafi, K 2005, Low-power thermal isolation for environmentally resistant microinstruments. in Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)., TPb27, pp. 532-535, 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami, Miami Beach, FL, United States, 1/30/05.
Lee SH, Chae J, Yoon S, Yazdi N, Najafi K. Low-power thermal isolation for environmentally resistant microinstruments. In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). 2005. p. 532-535. TPb27
Lee, Sang Hyun ; Chae, Junseok ; Yoon, Sangwon ; Yazdi, Navid ; Najafi, Khalil. / Low-power thermal isolation for environmentally resistant microinstruments. Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). 2005. pp. 532-535
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