Low-power thermal isolation for environmentally resistant microinstruments

This paper reports the design and analysis of a generic thermal isolation platform that can support a variety of MEMS devices and isolate them from the environment. The platform provides high thermal isolation from the environment by employing long meandering and hollow support metal beams. This isolation is needed for low-power (<10mW) micro oven-controlled constant-temperature operation over a -50∼70 °C temperature range. These beams also provide mechanical support. Optimal selection of the thermal and mechanical characteristics of these beams depends on many factors including beam materials, shape and structure, and the number of electrical signals. Metal-only, meandering and hollow beams provide the highest thermal isolation and mechanical stiffness. The combination of the isolation platform batch fabrication process and wafer-level instrument transfer/assembly onto the platform enables its broad and cost-effective application.