Loss in coupling due to crack in piezoelectric wafer based sensors and actuators

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Two different types of hysteresis are considered for loss mechanism of piezoelectric materials: one addressing the energy required to align the dipole orientation with the direction of electric field through 180° and 90° domain switching, and the other addressing the energy required to overcome the cracks in piezoelectric materials. By modeling piezoelectric materials as tetragonal crystallites with dipole moments, evolution of polarization due to applied electric filed is derived. Furthermore, dielectric, mechanical, and electromechanical losses due to the inclusions of cracks in piezoelectric solids are investigated. The influence of the existence of a crack is described through the characterization of the perturbation to stress and strain distribution. The strain energy release rates are used to determine the energy dissipation due to the crack. Correspondence principle is then applied to determine loss factors such that the constitutive laws governing the energy loss in dielectric, mechanical, and piezoelectric domains can be quantified. Therefore, the complex electromechanical coupling relations can be expressed by using a phase lag, which indicates the property degradation of piezoelectric materials.

Original languageEnglish (US)
Title of host publicationCollection of Technical Papers - 47th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference
Subtitle of host publication14th AIAA/ASME/AHS Adaptive Structures Conference, 8th AIAA Non-deterministic App
Pages4619-4630
Number of pages12
StatePublished - Dec 1 2006
Event47th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference - Newport, RI, United States
Duration: May 1 2006May 4 2006

Publication series

NameCollection of Technical Papers - AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference
Volume7
ISSN (Print)0273-4508

Other

Other47th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference
CountryUnited States
CityNewport, RI
Period5/1/065/4/06

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ASJC Scopus subject areas

  • Architecture
  • Materials Science(all)
  • Aerospace Engineering
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Zhou, X., & Chattopadhyay, A. (2006). Loss in coupling due to crack in piezoelectric wafer based sensors and actuators. In Collection of Technical Papers - 47th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference: 14th AIAA/ASME/AHS Adaptive Structures Conference, 8th AIAA Non-deterministic App (pp. 4619-4630). (Collection of Technical Papers - AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference; Vol. 7).