TY - GEN
T1 - Loss comparison of Si- and SiC-based modular multilevel converter for medium/high-voltage applications
AU - Wu, Liyao
AU - Qin, Jiangchao
AU - Saeedifard, Maryam
AU - Wasynczuk, Oleg
AU - Shenai, Krishna
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/5/8
Y1 - 2015/5/8
N2 - One of the main concerns in the operation of the modular multilevel converter (MMC), particularly for high-power applications, is its efficiency. SiC-based devices have the potential to provide significant efficiency improvement compared to Si devices. However, the possibility and benefits of using SiC-based devices instead of Si devices for high-power conversion have not been thoroughly explored. This paper reports on the results obtained from a detailed study to evaluate the performance of MMCs based on medium-voltage SiC MOSFETs and diodes with hybrid MMCs that employ Si IGBTs and SiC diodes. The results are based on detailed circuit simulations that use physics-based circuit models.
AB - One of the main concerns in the operation of the modular multilevel converter (MMC), particularly for high-power applications, is its efficiency. SiC-based devices have the potential to provide significant efficiency improvement compared to Si devices. However, the possibility and benefits of using SiC-based devices instead of Si devices for high-power conversion have not been thoroughly explored. This paper reports on the results obtained from a detailed study to evaluate the performance of MMCs based on medium-voltage SiC MOSFETs and diodes with hybrid MMCs that employ Si IGBTs and SiC diodes. The results are based on detailed circuit simulations that use physics-based circuit models.
UR - http://www.scopus.com/inward/record.url?scp=84937833029&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84937833029&partnerID=8YFLogxK
U2 - 10.1109/APEC.2015.7104368
DO - 10.1109/APEC.2015.7104368
M3 - Conference contribution
AN - SCOPUS:84937833029
T3 - Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC
SP - 311
EP - 316
BT - APEC 2015 - 30th Annual IEEE Applied Power Electronics Conference and Exposition
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 30th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2015
Y2 - 15 March 2015 through 19 March 2015
ER -