Long-term cortical recordings with microactuated microelectrodes

Nathan Jackson, Paula Stice, Murat Okandan, Jit Muthuswamy

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Scopus citations

Abstract

Current microelectrode array technologies often fail over a period of time presumably due to brain tissue reaction and micromotion around the implant site. We report here long-term cortical recordings from our novel microactuated microelectrode array technology. Our technology uses electro-thermal microactuators to move each of the three highly doped thin (∼4μm thick) polysilicon microelectrodes in the array. Multi-unit activity in n=2 rodents was monitored for a period of over 12 weeks. High-quality multi-unit data with noise levels less than 10 μV peak-to-peak and signal levels ranging from 100 μV to S mV (peak-to-peak) were obtained over the entire duration of study. The results of this study demonstrate the long-term recording capability of the microactuated microelectrodes in rodent models.

Original languageEnglish (US)
Title of host publicationProceedings of the 3rd International IEEE EMBS Conference on Neural Engineering
Pages141-143
Number of pages3
DOIs
StatePublished - Sep 25 2007
Externally publishedYes
Event3rd International IEEE EMBS Conference on Neural Engineering - Kohala Coast, HI, United States
Duration: May 2 2007May 5 2007

Publication series

NameProceedings of the 3rd International IEEE EMBS Conference on Neural Engineering

Other

Other3rd International IEEE EMBS Conference on Neural Engineering
CountryUnited States
CityKohala Coast, HI
Period5/2/075/5/07

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Keywords

  • Brain implants
  • MEMS
  • Movable microprobes
  • Neural prosthesis
  • Polysilicon

ASJC Scopus subject areas

  • Biotechnology
  • Bioengineering
  • Neuroscience (miscellaneous)

Cite this

Jackson, N., Stice, P., Okandan, M., & Muthuswamy, J. (2007). Long-term cortical recordings with microactuated microelectrodes. In Proceedings of the 3rd International IEEE EMBS Conference on Neural Engineering (pp. 141-143). [4227237] (Proceedings of the 3rd International IEEE EMBS Conference on Neural Engineering). https://doi.org/10.1109/CNE.2007.369632