Localized parylene-c bonding for micro packaging and cell encapsulation using reactive multilayer foils

Xiaotun Qiu, David Welch, Jennifer Blain Christen, Rui Tang, Jie Zhu, Jon Oiler, Cunjiang Yu, Ziyu Wang, Hongyu Yu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper described a novel physiologically compatible wafer bonding technique for bio-microelectromechnical systems (bio-MEMS) packaging. Room temperature bonding was performed between Parylene-C and silicon wafers with a thin Parylene-C coating using reactive Ni/Al multilayer foils as localized heaters. Live NIH 3T3 mouse fibroblast cells were encapsulated in the package and they survived the bonding process owing to the localization of heating. A numerical model was developed to predict the temperature evolutions in the parylene layers, silicon wafer and the encapsulated liquid during the bonding process. The simulation results were in agreement with the cell encapsulation experiment revealing that localized heating occurred in this bonding approach. This study proved the feasibility of reactive multilayer foil bonding technique for broad applications in packaging bio-MEMS and microfluidic systems. Copyright

Original languageEnglish (US)
Title of host publicationInternational Conference and Exhibition on Device Packaging 2010, Held in Conjunction with the Global Business Council, GBC 2010 Spring Conference
Pages611-630
Number of pages20
Volume1
StatePublished - 2010
EventInternational Conference and Exhibition on Device Packaging 2010, Held in Conjunction with the Spring Conference on Global Business Council, GBC 2010 - Scottsdale and Fountain Hills, AZ, United States
Duration: Mar 8 2010Mar 11 2010

Other

OtherInternational Conference and Exhibition on Device Packaging 2010, Held in Conjunction with the Spring Conference on Global Business Council, GBC 2010
CountryUnited States
CityScottsdale and Fountain Hills, AZ
Period3/8/103/11/10

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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