Local shear stress-strain response of Sn-3.5Ag/Cu solder joint with high fraction of intermetallic compounds: Experimental analysis

Engineering & Materials Science

• Shear strain 74%
• Intermetallics 66%
• Soldering alloys 61%
• Shear stress 57%
• Strain rate 28%
• Shear strength 22%
• Volume fraction 21%
• Soldering 18%
• Microelectronics 16%
• Fractography 10%
• Materials testing 9%
• Electronics industry 9%
• Brittle fracture 8%
• Metal foil 8%
• Anisotropy 8%
• Delamination 7%
• Microscopes 7%
• Computer program listings 7%
• Copper 6%
• Image processing 6%
• Experiments 5%
• Substrates 5%
• Monitoring 4%
• Temperature 3%

Chemical Compounds

• Shear Strain 100%
• Solder 77%
• Intermetallic Compound 67%
• Shear 57%
• Shear Strength 27%
• Soldering 21%
• Microelectronics 17%
• Volume 13%
• Fractography 12%
• Brittle Fracture 11%
• Strain 10%
• Size Reduction 10%
• Delamination 9%
• Computer Program 8%
• Foil 7%
• Anisotropy 7%
• Industry 5%
• Reduction 3%
• Time 2%