TY - GEN
T1 - Linear and Efficient NFET-MESFET 5G Cascode Power Amplifiers Using 45nm SOI CMOS
AU - Thornton, Trevor J.
AU - Li, Chaojiang
AU - Mehr, Payam
N1 - Funding Information:
This work was supported, in part, by NSF award number NNCI – 1542160.
Publisher Copyright:
© 2019 IEEE.
PY - 2019/10/14
Y1 - 2019/10/14
N2 - Integrated n-channel NFET-MESFET cascode power amplifiers (PAs) have been fabricated using a 45 nm SOI CMOS technology optimized for 5G applications. The cascode architecture combines the RF performance of the 40nm gate length NFET (fmax > 340 GHz) with the high voltage capability (VDD > 10 V) of the SOI MESFET. Load-pull measurements at 5.8 GHz confirm that a PA with 18 dBm saturated output power, >21dB gain, and >50% power added efficiency (PAE) can support 64QAM signals with 3% error vector magnitude and 25% average PAE at 6dB backed off power levels. These results suggest that an NFET-MESFET cascode PA might be suitable for low-cost 5G picocell/femtocell applications without the need for digital pre-distortion.
AB - Integrated n-channel NFET-MESFET cascode power amplifiers (PAs) have been fabricated using a 45 nm SOI CMOS technology optimized for 5G applications. The cascode architecture combines the RF performance of the 40nm gate length NFET (fmax > 340 GHz) with the high voltage capability (VDD > 10 V) of the SOI MESFET. Load-pull measurements at 5.8 GHz confirm that a PA with 18 dBm saturated output power, >21dB gain, and >50% power added efficiency (PAE) can support 64QAM signals with 3% error vector magnitude and 25% average PAE at 6dB backed off power levels. These results suggest that an NFET-MESFET cascode PA might be suitable for low-cost 5G picocell/femtocell applications without the need for digital pre-distortion.
KW - MESFET
KW - error vector magnitude
KW - fifth generation (5G) mobile
KW - power amplifiers
KW - silicon-on-insulator technology
UR - http://www.scopus.com/inward/record.url?scp=85100862677&partnerID=8YFLogxK
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U2 - 10.1109/S3S46989.2019.9320709
DO - 10.1109/S3S46989.2019.9320709
M3 - Conference contribution
AN - SCOPUS:85100862677
T3 - 2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference, S3S 2019
BT - 2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference, S3S 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference, S3S 2019
Y2 - 14 October 2019 through 17 October 2019
ER -