Kinetic study of the electrochemical vapor deposition of solid oxide electrolyte films on porous substrates

Jerry Lin, L. G.J. de Haart, K. J. de Vries, A. J. Burggraaf

Research output: Contribution to journalArticle

50 Citations (Scopus)

Abstract

The electrochemical vapor deposition (EVD) method is a very promising technique for making gas-tight dense solid electrolyte films on porous substrates. In this paper, theoretical and experimental studies on the kinetics of the deposition of dense yttria-stabilized zirconia films on porous ceramic substrates by the EVD method are presented. The more systematic theoretical analysis is based on a model which takes into account pore diffusion, bulk electrochemical transport, and surface charge-transfer reactions in the film growing process. The experimental work is focused on examining the effects of the oxygen partial pressure and substrate pore dimension on the EVD film growth rates. In accordance with the theoretical prediction, the pressure of oxygen source reactant (e.g., water vapor), the partial pressure of oxygen and substrate pore dimension are very important in affecting the rate-limiting step and film growth rate of the EVD process. In the present experimental conditions (e.g., low pressure of oxygen source reactant and small substrate pore-size/thickness ratio), the diffusion of the oxygen source reactant in the substrate pore is found to be the rate-limiting step for the EVD process.

Original languageEnglish (US)
Pages (from-to)3960-3966
Number of pages7
JournalJournal of the Electrochemical Society
Volume137
Issue number12
StatePublished - Dec 1990
Externally publishedYes

Fingerprint

Vapor deposition
Oxides
Electrolytes
vapor deposition
electrolytes
Kinetics
oxides
Oxygen
porosity
kinetics
Film growth
Substrates
oxygen
Partial pressure
partial pressure
thickness ratio
Yttria stabilized zirconia
Solid electrolytes
Steam
solid electrolytes

ASJC Scopus subject areas

  • Electrochemistry
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

Cite this

Kinetic study of the electrochemical vapor deposition of solid oxide electrolyte films on porous substrates. / Lin, Jerry; de Haart, L. G.J.; de Vries, K. J.; Burggraaf, A. J.

In: Journal of the Electrochemical Society, Vol. 137, No. 12, 12.1990, p. 3960-3966.

Research output: Contribution to journalArticle

Lin, Jerry ; de Haart, L. G.J. ; de Vries, K. J. ; Burggraaf, A. J. / Kinetic study of the electrochemical vapor deposition of solid oxide electrolyte films on porous substrates. In: Journal of the Electrochemical Society. 1990 ; Vol. 137, No. 12. pp. 3960-3966.
@article{eaa64374e5e24e3c851417dca74d8165,
title = "Kinetic study of the electrochemical vapor deposition of solid oxide electrolyte films on porous substrates",
abstract = "The electrochemical vapor deposition (EVD) method is a very promising technique for making gas-tight dense solid electrolyte films on porous substrates. In this paper, theoretical and experimental studies on the kinetics of the deposition of dense yttria-stabilized zirconia films on porous ceramic substrates by the EVD method are presented. The more systematic theoretical analysis is based on a model which takes into account pore diffusion, bulk electrochemical transport, and surface charge-transfer reactions in the film growing process. The experimental work is focused on examining the effects of the oxygen partial pressure and substrate pore dimension on the EVD film growth rates. In accordance with the theoretical prediction, the pressure of oxygen source reactant (e.g., water vapor), the partial pressure of oxygen and substrate pore dimension are very important in affecting the rate-limiting step and film growth rate of the EVD process. In the present experimental conditions (e.g., low pressure of oxygen source reactant and small substrate pore-size/thickness ratio), the diffusion of the oxygen source reactant in the substrate pore is found to be the rate-limiting step for the EVD process.",
author = "Jerry Lin and {de Haart}, {L. G.J.} and {de Vries}, {K. J.} and Burggraaf, {A. J.}",
year = "1990",
month = "12",
language = "English (US)",
volume = "137",
pages = "3960--3966",
journal = "Journal of the Electrochemical Society",
issn = "0013-4651",
publisher = "Electrochemical Society, Inc.",
number = "12",

}

TY - JOUR

T1 - Kinetic study of the electrochemical vapor deposition of solid oxide electrolyte films on porous substrates

AU - Lin, Jerry

AU - de Haart, L. G.J.

AU - de Vries, K. J.

AU - Burggraaf, A. J.

PY - 1990/12

Y1 - 1990/12

N2 - The electrochemical vapor deposition (EVD) method is a very promising technique for making gas-tight dense solid electrolyte films on porous substrates. In this paper, theoretical and experimental studies on the kinetics of the deposition of dense yttria-stabilized zirconia films on porous ceramic substrates by the EVD method are presented. The more systematic theoretical analysis is based on a model which takes into account pore diffusion, bulk electrochemical transport, and surface charge-transfer reactions in the film growing process. The experimental work is focused on examining the effects of the oxygen partial pressure and substrate pore dimension on the EVD film growth rates. In accordance with the theoretical prediction, the pressure of oxygen source reactant (e.g., water vapor), the partial pressure of oxygen and substrate pore dimension are very important in affecting the rate-limiting step and film growth rate of the EVD process. In the present experimental conditions (e.g., low pressure of oxygen source reactant and small substrate pore-size/thickness ratio), the diffusion of the oxygen source reactant in the substrate pore is found to be the rate-limiting step for the EVD process.

AB - The electrochemical vapor deposition (EVD) method is a very promising technique for making gas-tight dense solid electrolyte films on porous substrates. In this paper, theoretical and experimental studies on the kinetics of the deposition of dense yttria-stabilized zirconia films on porous ceramic substrates by the EVD method are presented. The more systematic theoretical analysis is based on a model which takes into account pore diffusion, bulk electrochemical transport, and surface charge-transfer reactions in the film growing process. The experimental work is focused on examining the effects of the oxygen partial pressure and substrate pore dimension on the EVD film growth rates. In accordance with the theoretical prediction, the pressure of oxygen source reactant (e.g., water vapor), the partial pressure of oxygen and substrate pore dimension are very important in affecting the rate-limiting step and film growth rate of the EVD process. In the present experimental conditions (e.g., low pressure of oxygen source reactant and small substrate pore-size/thickness ratio), the diffusion of the oxygen source reactant in the substrate pore is found to be the rate-limiting step for the EVD process.

UR - http://www.scopus.com/inward/record.url?scp=0025551723&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0025551723&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:0025551723

VL - 137

SP - 3960

EP - 3966

JO - Journal of the Electrochemical Society

JF - Journal of the Electrochemical Society

SN - 0013-4651

IS - 12

ER -