TY - GEN
T1 - INVITED
T2 - 56th Annual Design Automation Conference, DAC 2019
AU - Shrivastava, Aviral
AU - Didehban, Moslem
PY - 2019/6/2
Y1 - 2019/6/2
N2 - Advances in semiconductor technology have enabled unprecedented growth in safety-critical applications. However, due to unabated scaling, the unreliability of the underlying hardware is only getting worse. For a lot of applications, just recovering from errors is not enough - the latency between the occurrence of the fault to it's detection and recovery from the fault, i.e., in-time error resilience is of vital importance. This is especially true for real-time applications, where the timing of application events is a crucial part of the correctness of application. While software techniques for resilience are highly desirable since they can be flexibly applied, but achieving reliable, in-time software resilience is still an elusive goal. A new class of recent techniques have started to tackle this problem. This paper presents a succinct overview of existing software resilience techniques from the point-of-view of in-time resilience, and points out future challenges.
AB - Advances in semiconductor technology have enabled unprecedented growth in safety-critical applications. However, due to unabated scaling, the unreliability of the underlying hardware is only getting worse. For a lot of applications, just recovering from errors is not enough - the latency between the occurrence of the fault to it's detection and recovery from the fault, i.e., in-time error resilience is of vital importance. This is especially true for real-time applications, where the timing of application events is a crucial part of the correctness of application. While software techniques for resilience are highly desirable since they can be flexibly applied, but achieving reliable, in-time software resilience is still an elusive goal. A new class of recent techniques have started to tackle this problem. This paper presents a succinct overview of existing software resilience techniques from the point-of-view of in-time resilience, and points out future challenges.
UR - http://www.scopus.com/inward/record.url?scp=85067831222&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85067831222&partnerID=8YFLogxK
U2 - 10.1145/3316781.3323487
DO - 10.1145/3316781.3323487
M3 - Conference contribution
AN - SCOPUS:85067831222
T3 - Proceedings - Design Automation Conference
BT - Proceedings of the 56th Annual Design Automation Conference 2019, DAC 2019
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 2 June 2019 through 6 June 2019
ER -