@inproceedings{f5d502563a3e4dcdb8740488c78a7366,
title = "Investigation of the Interactions Between Low-Temperature Ag Paste Components and SiO2/Poly-Si(n) Contacts and the Impact on Contact Properties",
abstract = "Reducing poly-Si thickness to minimize parasitic absorption on a light-receiving side of a TOPCon solar cell without suffering voltage losses after metallization is a challenge in optimizing TOPCon performance. As an alternative to fire-through pastes, we investigate low-temperature Ag paste to SiO2/poly-Si passivating contacts through fabrication of electrical test structures to characterize the passivation quality and electrical transport across the metallized interface. With current paste chemistries, we find that solvent wetting of the poly-Si surface before evaporation and non-volatile binder resin adhesion to the surface after curing are major impediments which prevent Ag contact formation. However, low-resistance poly-Si/Ag interfaces formed with physical vapour deposition similarly degrade after annealing, indicating contacting issues related to the Ag content even in the absence of the organic paste components.",
author = "Bryan, {Jonathan L.} and Young, {David L.} and Paul Stradins and Holman, {Zachary C.}",
note = "Publisher Copyright: {\textcopyright} 2022 American Institute of Physics Inc.. All rights reserved.; 11th International Conference on Crystalline Silicon Photovoltaics, SiliconPV 2021 ; Conference date: 19-04-2021 Through 23-04-2021",
year = "2022",
month = aug,
day = "24",
doi = "10.1063/5.0090902",
language = "English (US)",
series = "AIP Conference Proceedings",
publisher = "American Institute of Physics Inc.",
editor = "Rolf Brendel and Christophe Ballif and Sebastien Dubois and Stefan Glunz and Giso Hahn and Jef Poortmans and Pierre Verlinden and Arthur Weeber",
booktitle = "SiliconPV 2021 - 11th International Conference on Crystalline Silicon Photovoltaics",
}