30 Citations (Scopus)

Abstract

Silver thin films (200 nm) were deposited on two different substrates, SiO2 and polyethylene naphthalate (PEN) by e-beam evaporation. The thickness of the Ag thin film on both substrates was determined to be 200 nm by Rutherford backscattering spectrometry. X-ray diffraction analysis showed that the coefficient of thermal expansion (CTE) of Ag on PEN (1.9 × 10- 5/°C) was the same as that of bulk Ag (1.9 × 10- 5/°C) while the CTE of Ag on SiO2 (3.1 × 10- 5/°C) was much larger than that of Ag on PEN. The results of our study indicate that the CTE of the Ag thin film is affected by the underlying substrate. In the case of Ag on PEN, the perpendicular and the lateral CTE were the same (1.9 × 10- 5/°C) because the Ag thin film expanded freely along all directions. In the case of Ag on SiO2, however, the lateral constraint of the thin film by the substrate caused anisotropic expansion and the apparent perpendicular CTE (3.1 × 10- 5/°C) was much larger than the apparent lateral CTE (0.54 × 10- 5/°C).

Original languageEnglish (US)
Pages (from-to)170-174
Number of pages5
JournalThin Solid Films
Volume513
Issue number1-2
DOIs
StatePublished - Aug 14 2006

Fingerprint

Silver
Thermal expansion
thermal expansion
silver
Polyethylene
X ray diffraction
Thin films
Polyethylenes
polyethylenes
Substrates
coefficients
thin films
diffraction
x rays
Rutherford backscattering spectroscopy
X ray diffraction analysis
Spectrometry
backscattering
Evaporation
evaporation

Keywords

  • Coefficient of thermal expansion
  • Evaporation
  • Polymer thin films
  • Silver
  • X-ray diffraction

ASJC Scopus subject areas

  • Surfaces, Coatings and Films
  • Condensed Matter Physics
  • Surfaces and Interfaces

Cite this

Investigation of coefficient of thermal expansion of silver thin film on different substrates using X-ray diffraction. / Zoo, Yeongseok; Adams, Daniel; Mayer, J. W.; Alford, Terry.

In: Thin Solid Films, Vol. 513, No. 1-2, 14.08.2006, p. 170-174.

Research output: Contribution to journalArticle

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abstract = "Silver thin films (200 nm) were deposited on two different substrates, SiO2 and polyethylene naphthalate (PEN) by e-beam evaporation. The thickness of the Ag thin film on both substrates was determined to be 200 nm by Rutherford backscattering spectrometry. X-ray diffraction analysis showed that the coefficient of thermal expansion (CTE) of Ag on PEN (1.9 × 10- 5/°C) was the same as that of bulk Ag (1.9 × 10- 5/°C) while the CTE of Ag on SiO2 (3.1 × 10- 5/°C) was much larger than that of Ag on PEN. The results of our study indicate that the CTE of the Ag thin film is affected by the underlying substrate. In the case of Ag on PEN, the perpendicular and the lateral CTE were the same (1.9 × 10- 5/°C) because the Ag thin film expanded freely along all directions. In the case of Ag on SiO2, however, the lateral constraint of the thin film by the substrate caused anisotropic expansion and the apparent perpendicular CTE (3.1 × 10- 5/°C) was much larger than the apparent lateral CTE (0.54 × 10- 5/°C).",
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T1 - Investigation of coefficient of thermal expansion of silver thin film on different substrates using X-ray diffraction

AU - Zoo, Yeongseok

AU - Adams, Daniel

AU - Mayer, J. W.

AU - Alford, Terry

PY - 2006/8/14

Y1 - 2006/8/14

N2 - Silver thin films (200 nm) were deposited on two different substrates, SiO2 and polyethylene naphthalate (PEN) by e-beam evaporation. The thickness of the Ag thin film on both substrates was determined to be 200 nm by Rutherford backscattering spectrometry. X-ray diffraction analysis showed that the coefficient of thermal expansion (CTE) of Ag on PEN (1.9 × 10- 5/°C) was the same as that of bulk Ag (1.9 × 10- 5/°C) while the CTE of Ag on SiO2 (3.1 × 10- 5/°C) was much larger than that of Ag on PEN. The results of our study indicate that the CTE of the Ag thin film is affected by the underlying substrate. In the case of Ag on PEN, the perpendicular and the lateral CTE were the same (1.9 × 10- 5/°C) because the Ag thin film expanded freely along all directions. In the case of Ag on SiO2, however, the lateral constraint of the thin film by the substrate caused anisotropic expansion and the apparent perpendicular CTE (3.1 × 10- 5/°C) was much larger than the apparent lateral CTE (0.54 × 10- 5/°C).

AB - Silver thin films (200 nm) were deposited on two different substrates, SiO2 and polyethylene naphthalate (PEN) by e-beam evaporation. The thickness of the Ag thin film on both substrates was determined to be 200 nm by Rutherford backscattering spectrometry. X-ray diffraction analysis showed that the coefficient of thermal expansion (CTE) of Ag on PEN (1.9 × 10- 5/°C) was the same as that of bulk Ag (1.9 × 10- 5/°C) while the CTE of Ag on SiO2 (3.1 × 10- 5/°C) was much larger than that of Ag on PEN. The results of our study indicate that the CTE of the Ag thin film is affected by the underlying substrate. In the case of Ag on PEN, the perpendicular and the lateral CTE were the same (1.9 × 10- 5/°C) because the Ag thin film expanded freely along all directions. In the case of Ag on SiO2, however, the lateral constraint of the thin film by the substrate caused anisotropic expansion and the apparent perpendicular CTE (3.1 × 10- 5/°C) was much larger than the apparent lateral CTE (0.54 × 10- 5/°C).

KW - Coefficient of thermal expansion

KW - Evaporation

KW - Polymer thin films

KW - Silver

KW - X-ray diffraction

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