Investigating a relationship among CPU and system temperatures, thermal power, and CPU tasking levels

Anna Haywood, Jon Sherbeck, Patrick Phelan, Georgios Varsamopoulos, Sandeep Gupta

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

This paper focuses on experiments investigating the quantity and quality of heat that can be captured from a liquid-cooled CPU on a computer server blade from a data center. This work also evaluates how effectively that waste heat energy dissipated from the CPUs residing on a server blade can be captured with a liquid-cooled thermal-extraction system. The ultimate goal behind this investigation is to determine the feasibility of using the thermal energy from a CPU to drive a cooling process. The unique application of this would be to capture the dissipated heat from many processors on many server blades within a data center and utilize that energy to drive a single-effect lithium bromide (Li-Br) refrigeration system. Another unique aspect of the investigation is the establishment of an interesting and useful relationship among CPU and system temperatures, thermal power, and CPU tasking levels. In response to the incoming system data, we explore the heat, temperature and power effects of adding insulation, varying water flow, tasking the CPU, and varying the cold plate-to-CPU clamping pressure. The aim is to provide an optimal and steady range of temperatures necessary for the chiller to operate. Results shown are for an IBM eServer xSeries 336 1U standalone server blade with dual Intel Xeon 3.6 GHz CPUs. Results are also shown for a simulation setup with an innovative cold plate that provides liquid cooling.

Original languageEnglish (US)
Title of host publicationInterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
Pages821-827
Number of pages7
DOIs
StatePublished - 2012
Event13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012 - San Diego, CA, United States
Duration: May 30 2012Jun 1 2012

Other

Other13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012
CountryUnited States
CitySan Diego, CA
Period5/30/126/1/12

Fingerprint

Program processors
Computer systems
Servers
Temperature
Liquids
Cooling
Hot Temperature
Waste heat
Refrigeration
Thermal energy
Insulation
Lithium
Water
Experiments

Keywords

  • absorption chiller
  • absorption refrigeration
  • CPU heat
  • CPU power
  • CPU temperature
  • data center waste heat
  • ERE
  • heat-extraction
  • liquid cooling
  • waste heat

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Haywood, A., Sherbeck, J., Phelan, P., Varsamopoulos, G., & Gupta, S. (2012). Investigating a relationship among CPU and system temperatures, thermal power, and CPU tasking levels. In InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM (pp. 821-827). [6231511] https://doi.org/10.1109/ITHERM.2012.6231511

Investigating a relationship among CPU and system temperatures, thermal power, and CPU tasking levels. / Haywood, Anna; Sherbeck, Jon; Phelan, Patrick; Varsamopoulos, Georgios; Gupta, Sandeep.

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM. 2012. p. 821-827 6231511.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Haywood, A, Sherbeck, J, Phelan, P, Varsamopoulos, G & Gupta, S 2012, Investigating a relationship among CPU and system temperatures, thermal power, and CPU tasking levels. in InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM., 6231511, pp. 821-827, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012, San Diego, CA, United States, 5/30/12. https://doi.org/10.1109/ITHERM.2012.6231511
Haywood A, Sherbeck J, Phelan P, Varsamopoulos G, Gupta S. Investigating a relationship among CPU and system temperatures, thermal power, and CPU tasking levels. In InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM. 2012. p. 821-827. 6231511 https://doi.org/10.1109/ITHERM.2012.6231511
Haywood, Anna ; Sherbeck, Jon ; Phelan, Patrick ; Varsamopoulos, Georgios ; Gupta, Sandeep. / Investigating a relationship among CPU and system temperatures, thermal power, and CPU tasking levels. InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM. 2012. pp. 821-827
@inproceedings{515e1e447f0d4a33b3d7ed23d180d42e,
title = "Investigating a relationship among CPU and system temperatures, thermal power, and CPU tasking levels",
abstract = "This paper focuses on experiments investigating the quantity and quality of heat that can be captured from a liquid-cooled CPU on a computer server blade from a data center. This work also evaluates how effectively that waste heat energy dissipated from the CPUs residing on a server blade can be captured with a liquid-cooled thermal-extraction system. The ultimate goal behind this investigation is to determine the feasibility of using the thermal energy from a CPU to drive a cooling process. The unique application of this would be to capture the dissipated heat from many processors on many server blades within a data center and utilize that energy to drive a single-effect lithium bromide (Li-Br) refrigeration system. Another unique aspect of the investigation is the establishment of an interesting and useful relationship among CPU and system temperatures, thermal power, and CPU tasking levels. In response to the incoming system data, we explore the heat, temperature and power effects of adding insulation, varying water flow, tasking the CPU, and varying the cold plate-to-CPU clamping pressure. The aim is to provide an optimal and steady range of temperatures necessary for the chiller to operate. Results shown are for an IBM eServer xSeries 336 1U standalone server blade with dual Intel Xeon 3.6 GHz CPUs. Results are also shown for a simulation setup with an innovative cold plate that provides liquid cooling.",
keywords = "absorption chiller, absorption refrigeration, CPU heat, CPU power, CPU temperature, data center waste heat, ERE, heat-extraction, liquid cooling, waste heat",
author = "Anna Haywood and Jon Sherbeck and Patrick Phelan and Georgios Varsamopoulos and Sandeep Gupta",
year = "2012",
doi = "10.1109/ITHERM.2012.6231511",
language = "English (US)",
isbn = "9781424495320",
pages = "821--827",
booktitle = "InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM",

}

TY - GEN

T1 - Investigating a relationship among CPU and system temperatures, thermal power, and CPU tasking levels

AU - Haywood, Anna

AU - Sherbeck, Jon

AU - Phelan, Patrick

AU - Varsamopoulos, Georgios

AU - Gupta, Sandeep

PY - 2012

Y1 - 2012

N2 - This paper focuses on experiments investigating the quantity and quality of heat that can be captured from a liquid-cooled CPU on a computer server blade from a data center. This work also evaluates how effectively that waste heat energy dissipated from the CPUs residing on a server blade can be captured with a liquid-cooled thermal-extraction system. The ultimate goal behind this investigation is to determine the feasibility of using the thermal energy from a CPU to drive a cooling process. The unique application of this would be to capture the dissipated heat from many processors on many server blades within a data center and utilize that energy to drive a single-effect lithium bromide (Li-Br) refrigeration system. Another unique aspect of the investigation is the establishment of an interesting and useful relationship among CPU and system temperatures, thermal power, and CPU tasking levels. In response to the incoming system data, we explore the heat, temperature and power effects of adding insulation, varying water flow, tasking the CPU, and varying the cold plate-to-CPU clamping pressure. The aim is to provide an optimal and steady range of temperatures necessary for the chiller to operate. Results shown are for an IBM eServer xSeries 336 1U standalone server blade with dual Intel Xeon 3.6 GHz CPUs. Results are also shown for a simulation setup with an innovative cold plate that provides liquid cooling.

AB - This paper focuses on experiments investigating the quantity and quality of heat that can be captured from a liquid-cooled CPU on a computer server blade from a data center. This work also evaluates how effectively that waste heat energy dissipated from the CPUs residing on a server blade can be captured with a liquid-cooled thermal-extraction system. The ultimate goal behind this investigation is to determine the feasibility of using the thermal energy from a CPU to drive a cooling process. The unique application of this would be to capture the dissipated heat from many processors on many server blades within a data center and utilize that energy to drive a single-effect lithium bromide (Li-Br) refrigeration system. Another unique aspect of the investigation is the establishment of an interesting and useful relationship among CPU and system temperatures, thermal power, and CPU tasking levels. In response to the incoming system data, we explore the heat, temperature and power effects of adding insulation, varying water flow, tasking the CPU, and varying the cold plate-to-CPU clamping pressure. The aim is to provide an optimal and steady range of temperatures necessary for the chiller to operate. Results shown are for an IBM eServer xSeries 336 1U standalone server blade with dual Intel Xeon 3.6 GHz CPUs. Results are also shown for a simulation setup with an innovative cold plate that provides liquid cooling.

KW - absorption chiller

KW - absorption refrigeration

KW - CPU heat

KW - CPU power

KW - CPU temperature

KW - data center waste heat

KW - ERE

KW - heat-extraction

KW - liquid cooling

KW - waste heat

UR - http://www.scopus.com/inward/record.url?scp=84866171006&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84866171006&partnerID=8YFLogxK

U2 - 10.1109/ITHERM.2012.6231511

DO - 10.1109/ITHERM.2012.6231511

M3 - Conference contribution

AN - SCOPUS:84866171006

SN - 9781424495320

SP - 821

EP - 827

BT - InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

ER -