Interlaminar stress analysis of shell structures with piezoelectric patch including thermal loading

Soo Kim Heung Soo Kim, X. Zhou, Aditi Chattopadhyay

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

Interlaminar stress distributions in laminated shell structures using coupled thermal-mechanical piezoelectric-mechanical models were analyzed. Numerical analysis was performed for investigation of laminated composite shells with multiple surface bonded actuators. The piezoelectric loading and thermal loading were considered and the induced deflections and stress distributions were presented. The results obtained indicated that the improved shear deformation theory correlates well with elasticity solutions. The stress analysis results show that thermal mismatch occurs at the interface between the actuator and the primary structure thus resulting in stress concentrations at those interfaces.

Original languageEnglish (US)
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
EditorsV.S. Rao
Pages364-375
Number of pages12
Volume4326
DOIs
StatePublished - 2001
EventSmart Structures and Materials 2001-Modeling, Signal Processing, and Control in Smart Structures- - Newport Beach, CA, United States
Duration: Mar 5 2001Mar 8 2001

Other

OtherSmart Structures and Materials 2001-Modeling, Signal Processing, and Control in Smart Structures-
CountryUnited States
CityNewport Beach, CA
Period3/5/013/8/01

Fingerprint

interlaminar stress
stress analysis
Stress analysis
stress distribution
Stress concentration
actuators
stress concentration
Actuators
numerical analysis
deflection
elastic properties
Laminated composites
shear
Shear deformation
composite materials
Numerical analysis
Elasticity
Hot Temperature

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

Cite this

Heung Soo Kim, S. K., Zhou, X., & Chattopadhyay, A. (2001). Interlaminar stress analysis of shell structures with piezoelectric patch including thermal loading. In V. S. Rao (Ed.), Proceedings of SPIE - The International Society for Optical Engineering (Vol. 4326, pp. 364-375) https://doi.org/10.1117/12.436489

Interlaminar stress analysis of shell structures with piezoelectric patch including thermal loading. / Heung Soo Kim, Soo Kim; Zhou, X.; Chattopadhyay, Aditi.

Proceedings of SPIE - The International Society for Optical Engineering. ed. / V.S. Rao. Vol. 4326 2001. p. 364-375.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Heung Soo Kim, SK, Zhou, X & Chattopadhyay, A 2001, Interlaminar stress analysis of shell structures with piezoelectric patch including thermal loading. in VS Rao (ed.), Proceedings of SPIE - The International Society for Optical Engineering. vol. 4326, pp. 364-375, Smart Structures and Materials 2001-Modeling, Signal Processing, and Control in Smart Structures-, Newport Beach, CA, United States, 3/5/01. https://doi.org/10.1117/12.436489
Heung Soo Kim SK, Zhou X, Chattopadhyay A. Interlaminar stress analysis of shell structures with piezoelectric patch including thermal loading. In Rao VS, editor, Proceedings of SPIE - The International Society for Optical Engineering. Vol. 4326. 2001. p. 364-375 https://doi.org/10.1117/12.436489
Heung Soo Kim, Soo Kim ; Zhou, X. ; Chattopadhyay, Aditi. / Interlaminar stress analysis of shell structures with piezoelectric patch including thermal loading. Proceedings of SPIE - The International Society for Optical Engineering. editor / V.S. Rao. Vol. 4326 2001. pp. 364-375
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