Interlaminar stress analysis of shell structures with piezoelectric patch including thermal loading

Heung Soo Kim, Xu Zhou, Aditi Chattopadhyay

Research output: Contribution to journalArticle

51 Citations (Scopus)

Abstract

Interlaminar stress distribution in smart composite shells using a coupled thermal-piezoelectric-mechanical model is investigated. To maintain local accuracy of stress distributions, the trial displacement field is assumed layerwise higher order and C0 continuous through the entire laminate thickness, accommodating zigzag in-plane warping and interlaminar shear stress continuity. The temperature and electrical fields are modeled using higher-order descriptions that can satisfy surface flux boundary conditions at structural surfaces and equipotential conditions at electrode surfaces. These assumptions ensure computational efficiency. A variational principle, addressing the interaction between thermal, piezoelectric, and mechanical fields, is used to derive the governing equations of equilibrium. The proposed theory is used to investigate the cylindrical bending problem of simply supported composite host structures with attached piezoelectric actuators, subject to a combination of mechanical, piezoelectric, and thermal loading. The interlaminar stress distributions under comprehensive loading are presented for different geometries and stacking sequences. The effects of two-way piezoelectric and thermal coupling on the stress distributions are investigated. The significance of the thermal mismatch effect on interlaminar stress distribution is also discussed. The results from present theory are validated exact elasticity solutions.

Original languageEnglish (US)
Pages (from-to)2517-2525
Number of pages9
JournalAIAA Journal
Volume40
Issue number12
StatePublished - Dec 2002

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Stress analysis
Stress concentration
Piezoelectric actuators
Composite materials
Computational efficiency
Laminates
Shear stress
Elasticity
Hot Temperature
Boundary conditions
Fluxes
Electrodes
Geometry
Temperature

ASJC Scopus subject areas

  • Aerospace Engineering

Cite this

Interlaminar stress analysis of shell structures with piezoelectric patch including thermal loading. / Kim, Heung Soo; Zhou, Xu; Chattopadhyay, Aditi.

In: AIAA Journal, Vol. 40, No. 12, 12.2002, p. 2517-2525.

Research output: Contribution to journalArticle

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