Interface nanochemistry effects on stainless steel diffusion bonding

M. J. Cox, Ray Carpenter, R. W. Carpenter

Research output: Contribution to journalArticle

5 Scopus citations

Abstract

The diffusion-bonding behavior of single-phase austenitic stainless steel depends strongly on the chemistry of the surfaces to be bonded. We found that very smooth (0.5 nm root-mean-square (RMS) roughness), mechanically polished and lapped substrates would bond completely in ultrahigh vacuum (UHV) in 1 hour at 1000 °C under 3.5 MPa uniaxial pressure, if the native oxide on the substrates was removed by ion-beam cleaning, as shown by in-situ Auger analysis. No voids were observed in these bonded interfaces by transmission electron microscopy (TEM), and the strength was equal to that of the unbonded bare material. No bond formed between the substrates if in-situ ion cleaning was not used. The rougher cleaned substrates partially bonded, indicating that roughness, as well as native oxides, reduced the bonding kinetics.

Original languageEnglish (US)
Pages (from-to)437-442
Number of pages6
JournalMetallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
Volume33
Issue number2
DOIs
StatePublished - Jan 1 2002

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ASJC Scopus subject areas

  • Condensed Matter Physics
  • Mechanics of Materials
  • Metals and Alloys

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