Inter- and transgranular nucleation and growth of voids in shock loaded copper bicrystals

Elizabeth Fortin, Benjamin Shaffer, Saul Opie, Matthew Catlett, Pedro Peralta

Research output: Chapter in Book/Report/Conference proceedingChapter

Abstract

Understanding the evolution of dynamic deformation and damage due to spall at grain boundaries (GBs) can provide a basis for connecting micro- to macroscale failure behavior in polycrystalline metals undergoing extreme loading conditions. Bicrystal samples grown from the melt were tested using flyer-plate impacts with shock stresses from 3 to 5 GPa. Pulse duration and crystal orientation along the shock direction were varied for a fixed boundary misorientation to determine thresholds for void nucleation and coalescence in both the bulk and the boundary. Sample characterization was performed using electron backscattering diffraction (EBSD) and scanning electron microscopy (SEM) to gather microstructural information at and around the GB, with emphasis on damage at the boundary. Simulations were performed to interpret experimental results. Initial results show that the kinetics of damage growth at the boundary is strongly affected by pulse duration and stress level and that once a threshold level is reached, damage increases faster at the GB compared to the grain bulks.

Original languageEnglish (US)
Title of host publicationMinerals, Metals and Materials Series
PublisherSpringer International Publishing
Pages97-108
Number of pages12
DOIs
StatePublished - Jan 1 2019

Publication series

NameMinerals, Metals and Materials Series
ISSN (Print)2367-1181
ISSN (Electronic)2367-1696

Fingerprint

Bicrystals
Copper
Grain boundaries
Nucleation
Backscattering
Coalescence
Crystal orientation
Diffraction
Metals
Scanning electron microscopy
Kinetics
Electrons

Keywords

  • Bicrystal
  • Grain boundary
  • Pulse duration
  • Spall

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Energy Engineering and Power Technology
  • Mechanics of Materials
  • Metals and Alloys
  • Materials Chemistry

Cite this

Fortin, E., Shaffer, B., Opie, S., Catlett, M., & Peralta, P. (2019). Inter- and transgranular nucleation and growth of voids in shock loaded copper bicrystals. In Minerals, Metals and Materials Series (pp. 97-108). (Minerals, Metals and Materials Series). Springer International Publishing. https://doi.org/10.1007/978-3-030-05749-7_11

Inter- and transgranular nucleation and growth of voids in shock loaded copper bicrystals. / Fortin, Elizabeth; Shaffer, Benjamin; Opie, Saul; Catlett, Matthew; Peralta, Pedro.

Minerals, Metals and Materials Series. Springer International Publishing, 2019. p. 97-108 (Minerals, Metals and Materials Series).

Research output: Chapter in Book/Report/Conference proceedingChapter

Fortin, E, Shaffer, B, Opie, S, Catlett, M & Peralta, P 2019, Inter- and transgranular nucleation and growth of voids in shock loaded copper bicrystals. in Minerals, Metals and Materials Series. Minerals, Metals and Materials Series, Springer International Publishing, pp. 97-108. https://doi.org/10.1007/978-3-030-05749-7_11
Fortin E, Shaffer B, Opie S, Catlett M, Peralta P. Inter- and transgranular nucleation and growth of voids in shock loaded copper bicrystals. In Minerals, Metals and Materials Series. Springer International Publishing. 2019. p. 97-108. (Minerals, Metals and Materials Series). https://doi.org/10.1007/978-3-030-05749-7_11
Fortin, Elizabeth ; Shaffer, Benjamin ; Opie, Saul ; Catlett, Matthew ; Peralta, Pedro. / Inter- and transgranular nucleation and growth of voids in shock loaded copper bicrystals. Minerals, Metals and Materials Series. Springer International Publishing, 2019. pp. 97-108 (Minerals, Metals and Materials Series).
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