Integration of magnetic materials into package RF and power inductors on organic substrates for system in package (SiP) applications

Hao Wu, Donald S. Gardner, Cheng Lv, Zhihua Zou, Hongbin Yu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Scopus citations

Abstract

In this paper, soft ferromagnetic materials were deposited on organic packaging substrates to explore their potential applications in in-package inductors. Amorphous cobalt alloy, Co-Zr-Ta-B, was chosen due to its high saturation magnetization, low coercivity and small magnetostriction. As-deposited films were characterized by vibrating sample magnetometer (VSM) showing comparable magnetic properties in comparison to the films on quartz and silicon wafers. Stripline and spiral inductors with Co-Zr-Ta-B films were fabricated on package substrates to explore their potential in-package RF and power inductor applications.

Original languageEnglish (US)
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1290-1295
Number of pages6
ISBN (Electronic)9781479924073
DOIs
StatePublished - Sep 11 2014
Event64th Electronic Components and Technology Conference, ECTC 2014 - Orlando, United States
Duration: May 27 2014May 30 2014

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other64th Electronic Components and Technology Conference, ECTC 2014
CountryUnited States
CityOrlando
Period5/27/145/30/14

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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    Wu, H., Gardner, D. S., Lv, C., Zou, Z., & Yu, H. (2014). Integration of magnetic materials into package RF and power inductors on organic substrates for system in package (SiP) applications. In Proceedings - Electronic Components and Technology Conference (pp. 1290-1295). [6897458] (Proceedings - Electronic Components and Technology Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2014.6897458