Integration of magnetic materials into package RF and power inductors on organic substrates for system in package (SiP) applications

Hao Wu, Donald S. Gardner, Cheng Lv, Zhihua Zou, Hongbin Yu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

In this paper, soft ferromagnetic materials were deposited on organic packaging substrates to explore their potential applications in in-package inductors. Amorphous cobalt alloy, Co-Zr-Ta-B, was chosen due to its high saturation magnetization, low coercivity and small magnetostriction. As-deposited films were characterized by vibrating sample magnetometer (VSM) showing comparable magnetic properties in comparison to the films on quartz and silicon wafers. Stripline and spiral inductors with Co-Zr-Ta-B films were fabricated on package substrates to explore their potential in-package RF and power inductor applications.

Original languageEnglish (US)
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1290-1295
Number of pages6
ISBN (Print)9781479924073
DOIs
StatePublished - Sep 11 2014
Event64th Electronic Components and Technology Conference, ECTC 2014 - Orlando, United States
Duration: May 27 2014May 30 2014

Other

Other64th Electronic Components and Technology Conference, ECTC 2014
CountryUnited States
CityOrlando
Period5/27/145/30/14

Fingerprint

Power inductors
Magnetic materials
Substrates
Cobalt alloys
Quartz
Ferromagnetic materials
Magnetostriction
Amorphous alloys
Magnetometers
Saturation magnetization
Coercive force
Silicon wafers
Magnetic properties
Packaging
System-in-package

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Wu, H., Gardner, D. S., Lv, C., Zou, Z., & Yu, H. (2014). Integration of magnetic materials into package RF and power inductors on organic substrates for system in package (SiP) applications. In Proceedings - Electronic Components and Technology Conference (pp. 1290-1295). [6897458] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2014.6897458

Integration of magnetic materials into package RF and power inductors on organic substrates for system in package (SiP) applications. / Wu, Hao; Gardner, Donald S.; Lv, Cheng; Zou, Zhihua; Yu, Hongbin.

Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., 2014. p. 1290-1295 6897458.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Wu, H, Gardner, DS, Lv, C, Zou, Z & Yu, H 2014, Integration of magnetic materials into package RF and power inductors on organic substrates for system in package (SiP) applications. in Proceedings - Electronic Components and Technology Conference., 6897458, Institute of Electrical and Electronics Engineers Inc., pp. 1290-1295, 64th Electronic Components and Technology Conference, ECTC 2014, Orlando, United States, 5/27/14. https://doi.org/10.1109/ECTC.2014.6897458
Wu H, Gardner DS, Lv C, Zou Z, Yu H. Integration of magnetic materials into package RF and power inductors on organic substrates for system in package (SiP) applications. In Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc. 2014. p. 1290-1295. 6897458 https://doi.org/10.1109/ECTC.2014.6897458
Wu, Hao ; Gardner, Donald S. ; Lv, Cheng ; Zou, Zhihua ; Yu, Hongbin. / Integration of magnetic materials into package RF and power inductors on organic substrates for system in package (SiP) applications. Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 1290-1295
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