Any review of the development of microelectronics technology tends to emphasise improvements in packing density. However, there are also a number of other important parallel developments. This paper considers the factors which have contributed to an explosion of data concerning the device fabrication process. Ways in which that data may be structured and handled as technical or product information are reviewed and some of the implications for success are also out‐lined.
ASJC Scopus subject areas
- Electrical and Electronic Engineering