Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability

Engineering & Materials Science

• Lead-free solders 97%
• Metallurgy 94%
• Intermetallics 83%
• Soldering alloys 64%
• Substrates 55%
• Microstructure 52%
• Fatigue of materials 18%
• Mechanical testing 15%
• Nanoindentation 15%
• Thermal cycling 14%
• Needles 13%
• Surface treatment 13%
• Energy dispersive spectroscopy 13%
• Fatigue crack propagation 13%
• Thermal expansion 13%
• Scanning electron microscopy 10%
• Coatings 9%

Chemical Compounds

• Metallurgy 100%
• Solder 97%
• Microstructure 52%
• Intermetallic Compound 50%
• Plate Like Crystal 37%
• Surface 25%
• Crack Propagation 21%
• Interfacial Structure 20%
• Thermal Cycling 19%
• Thermal Expansion 16%
• Energy-Dispersive Spectroscopy 16%
• Coating Agent 9%
• Scanning Electron Microscopy 9%

Physics & Astronomy

• metallurgy 98%
• solders 87%
• intermetallics 70%
• microstructure 46%
• cycles 17%
• crack propagation 14%
• surface treatment 13%
• nanoindentation 13%
• needles 13%
• thermal expansion 11%
• electron energy 9%
• damage 9%
• coatings 8%
• scanning electron microscopy 8%
• causes 7%
• matrices 7%
• spectroscopy 6%