Abstract
The affect of the ground step discontinuity created by a difference in package and printed circuit board (PCB) thickness was studied. It is observed that the step in the reference conductor can be represented by a series inductance and its value depends on the height of the step and the width of the transmission line above it. The overall circuit affects for a packaged transistors were simulated with commercially available electromagnetic 2D and 3D CAD tools. The results show that the discontinuity creates an inductive feedback path around the package.
| Original language | English (US) |
|---|---|
| Title of host publication | IEEE Topical Meeting on Electrical Performance of Electronic Packaging |
| Pages | 49-52 |
| Number of pages | 4 |
| State | Published - 2004 |
| Event | IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging - Portland, OR, United States Duration: Oct 25 2004 → Oct 27 2004 |
Other
| Other | IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging |
|---|---|
| Country/Territory | United States |
| City | Portland, OR |
| Period | 10/25/04 → 10/27/04 |
ASJC Scopus subject areas
- Engineering(all)