Increased feedback due to package mounting

Peter H. Aaen, Jaime A. Plá, Constantine Balanis

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

The affect of the ground step discontinuity created by a difference in package and printed circuit board (PCB) thickness was studied. It is observed that the step in the reference conductor can be represented by a series inductance and its value depends on the height of the step and the width of the transmission line above it. The overall circuit affects for a packaged transistors were simulated with commercially available electromagnetic 2D and 3D CAD tools. The results show that the discontinuity creates an inductive feedback path around the package.

Original languageEnglish (US)
Title of host publicationIEEE Topical Meeting on Electrical Performance of Electronic Packaging
Pages49-52
Number of pages4
StatePublished - 2004
EventIEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging - Portland, OR, United States
Duration: Oct 25 2004Oct 27 2004

Other

OtherIEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging
CountryUnited States
CityPortland, OR
Period10/25/0410/27/04

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Aaen, P. H., Plá, J. A., & Balanis, C. (2004). Increased feedback due to package mounting. In IEEE Topical Meeting on Electrical Performance of Electronic Packaging (pp. 49-52)