Improvement of the thermal stability of silver metallization

H. C. Kim, Terry Alford

Research output: Contribution to journalArticle

63 Scopus citations

Abstract

Improvement of the thermal stability of silver metallization was discussed. The thermal stability of Ag(Al) alloy thin films on SiO2 was investigated and compared to pure Ag thin films on SiO2 substrates. The Ag(Al) thin films demonstrated good thermal stability on the SiO 2 layer without any diffusion barrier and the Ag alloy thin films were stable up to 600°C for 1 h in vacuum. It was confirmed that the thermal stability of Ag metallization on SiO2 substrates can be enhanced by using Ag(Al) alloy thin films.

Original languageEnglish (US)
Pages (from-to)5393-5395
Number of pages3
JournalJournal of Applied Physics
Volume94
Issue number8
DOIs
StatePublished - Oct 15 2003

ASJC Scopus subject areas

  • Physics and Astronomy(all)

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