Improvement of the thermal stability of silver metallization was discussed. The thermal stability of Ag(Al) alloy thin films on SiO2 was investigated and compared to pure Ag thin films on SiO2 substrates. The Ag(Al) thin films demonstrated good thermal stability on the SiO 2 layer without any diffusion barrier and the Ag alloy thin films were stable up to 600°C for 1 h in vacuum. It was confirmed that the thermal stability of Ag metallization on SiO2 substrates can be enhanced by using Ag(Al) alloy thin films.
|Original language||English (US)|
|Number of pages||3|
|Journal||Journal of Applied Physics|
|State||Published - Oct 15 2003|
ASJC Scopus subject areas
- Physics and Astronomy(all)