Improvement of the thermal stability of silver metallization

H. C. Kim; Terry Alford

doi:10.1063/1.1609646

Improvement of the thermal stability of silver metallization

H. C. Kim, Terry Alford

Research output: Contribution to journal › Article › peer-review

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Abstract

Improvement of the thermal stability of silver metallization was discussed. The thermal stability of Ag(Al) alloy thin films on SiO₂ was investigated and compared to pure Ag thin films on SiO₂ substrates. The Ag(Al) thin films demonstrated good thermal stability on the SiO ₂ layer without any diffusion barrier and the Ag alloy thin films were stable up to 600°C for 1 h in vacuum. It was confirmed that the thermal stability of Ag metallization on SiO₂ substrates can be enhanced by using Ag(Al) alloy thin films.

Original language	English (US)
Pages (from-to)	5393-5395
Number of pages	3
Journal	Journal of Applied Physics
Volume	94
Issue number	8
DOIs	https://doi.org/10.1063/1.1609646
State	Published - Oct 15 2003

ASJC Scopus subject areas

General Physics and Astronomy

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10.1063/1.1609646

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@article{cc2563670f7b42b4baaa79ec9d6ab18e,

title = "Improvement of the thermal stability of silver metallization",

abstract = "Improvement of the thermal stability of silver metallization was discussed. The thermal stability of Ag(Al) alloy thin films on SiO2 was investigated and compared to pure Ag thin films on SiO2 substrates. The Ag(Al) thin films demonstrated good thermal stability on the SiO 2 layer without any diffusion barrier and the Ag alloy thin films were stable up to 600°C for 1 h in vacuum. It was confirmed that the thermal stability of Ag metallization on SiO2 substrates can be enhanced by using Ag(Al) alloy thin films.",

author = "Kim, {H. C.} and Terry Alford",

year = "2003",

month = oct,

day = "15",

doi = "10.1063/1.1609646",

language = "English (US)",

volume = "94",

pages = "5393--5395",

journal = "Journal of Applied Physics",

issn = "0021-8979",

publisher = "American Institute of Physics Publising LLC",

number = "8",

}

TY - JOUR

T1 - Improvement of the thermal stability of silver metallization

AU - Kim, H. C.

AU - Alford, Terry

PY - 2003/10/15

Y1 - 2003/10/15

N2 - Improvement of the thermal stability of silver metallization was discussed. The thermal stability of Ag(Al) alloy thin films on SiO2 was investigated and compared to pure Ag thin films on SiO2 substrates. The Ag(Al) thin films demonstrated good thermal stability on the SiO 2 layer without any diffusion barrier and the Ag alloy thin films were stable up to 600°C for 1 h in vacuum. It was confirmed that the thermal stability of Ag metallization on SiO2 substrates can be enhanced by using Ag(Al) alloy thin films.

AB - Improvement of the thermal stability of silver metallization was discussed. The thermal stability of Ag(Al) alloy thin films on SiO2 was investigated and compared to pure Ag thin films on SiO2 substrates. The Ag(Al) thin films demonstrated good thermal stability on the SiO 2 layer without any diffusion barrier and the Ag alloy thin films were stable up to 600°C for 1 h in vacuum. It was confirmed that the thermal stability of Ag metallization on SiO2 substrates can be enhanced by using Ag(Al) alloy thin films.

UR - http://www.scopus.com/inward/record.url?scp=0242272315&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0242272315&partnerID=8YFLogxK

U2 - 10.1063/1.1609646

DO - 10.1063/1.1609646

M3 - Article

AN - SCOPUS:0242272315

SN - 0021-8979

VL - 94

SP - 5393

EP - 5395

JO - Journal of Applied Physics

JF - Journal of Applied Physics

IS - 8

ER -

Improvement of the thermal stability of silver metallization

Abstract

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