Improvement of the thermal stability of silver metallization

H. C. Kim, Terry Alford

Research output: Contribution to journalArticle

59 Citations (Scopus)

Abstract

Improvement of the thermal stability of silver metallization was discussed. The thermal stability of Ag(Al) alloy thin films on SiO2 was investigated and compared to pure Ag thin films on SiO2 substrates. The Ag(Al) thin films demonstrated good thermal stability on the SiO 2 layer without any diffusion barrier and the Ag alloy thin films were stable up to 600°C for 1 h in vacuum. It was confirmed that the thermal stability of Ag metallization on SiO2 substrates can be enhanced by using Ag(Al) alloy thin films.

Original languageEnglish (US)
Pages (from-to)5393-5395
Number of pages3
JournalJournal of Applied Physics
Volume94
Issue number8
DOIs
StatePublished - Oct 15 2003

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thermal stability
silver
thin films
vacuum

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)
  • Physics and Astronomy(all)

Cite this

Improvement of the thermal stability of silver metallization. / Kim, H. C.; Alford, Terry.

In: Journal of Applied Physics, Vol. 94, No. 8, 15.10.2003, p. 5393-5395.

Research output: Contribution to journalArticle

@article{cc2563670f7b42b4baaa79ec9d6ab18e,
title = "Improvement of the thermal stability of silver metallization",
abstract = "Improvement of the thermal stability of silver metallization was discussed. The thermal stability of Ag(Al) alloy thin films on SiO2 was investigated and compared to pure Ag thin films on SiO2 substrates. The Ag(Al) thin films demonstrated good thermal stability on the SiO 2 layer without any diffusion barrier and the Ag alloy thin films were stable up to 600°C for 1 h in vacuum. It was confirmed that the thermal stability of Ag metallization on SiO2 substrates can be enhanced by using Ag(Al) alloy thin films.",
author = "Kim, {H. C.} and Terry Alford",
year = "2003",
month = "10",
day = "15",
doi = "10.1063/1.1609646",
language = "English (US)",
volume = "94",
pages = "5393--5395",
journal = "Journal of Applied Physics",
issn = "0021-8979",
publisher = "American Institute of Physics Publising LLC",
number = "8",

}

TY - JOUR

T1 - Improvement of the thermal stability of silver metallization

AU - Kim, H. C.

AU - Alford, Terry

PY - 2003/10/15

Y1 - 2003/10/15

N2 - Improvement of the thermal stability of silver metallization was discussed. The thermal stability of Ag(Al) alloy thin films on SiO2 was investigated and compared to pure Ag thin films on SiO2 substrates. The Ag(Al) thin films demonstrated good thermal stability on the SiO 2 layer without any diffusion barrier and the Ag alloy thin films were stable up to 600°C for 1 h in vacuum. It was confirmed that the thermal stability of Ag metallization on SiO2 substrates can be enhanced by using Ag(Al) alloy thin films.

AB - Improvement of the thermal stability of silver metallization was discussed. The thermal stability of Ag(Al) alloy thin films on SiO2 was investigated and compared to pure Ag thin films on SiO2 substrates. The Ag(Al) thin films demonstrated good thermal stability on the SiO 2 layer without any diffusion barrier and the Ag alloy thin films were stable up to 600°C for 1 h in vacuum. It was confirmed that the thermal stability of Ag metallization on SiO2 substrates can be enhanced by using Ag(Al) alloy thin films.

UR - http://www.scopus.com/inward/record.url?scp=0242272315&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0242272315&partnerID=8YFLogxK

U2 - 10.1063/1.1609646

DO - 10.1063/1.1609646

M3 - Article

AN - SCOPUS:0242272315

VL - 94

SP - 5393

EP - 5395

JO - Journal of Applied Physics

JF - Journal of Applied Physics

SN - 0021-8979

IS - 8

ER -