Improved Si3N4/Si/GaAs metal-insulator-semiconductor interfaces by in situ anneal of the as-deposited Si

Meng Tao, Andrei E. Botchkarev, Daegyu Park, John Reed, S. Jay Chey, Joseph E. Van Nostrand, David G. Cahill, Hadis Morkoç

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12 Scopus citations

Abstract

Si interlayers in GaAs metal-insulator-semiconductor structures are essential for interfaces with device quality. The incompatible growth temperature of Si on GaAs, however, presents a dilemma between the crystallinity of Si and the stoichiometry of GaAs. We circumvented this dilemma by a new approach: a high-temperature in situ anneal following the low-temperature Si deposition. The idea is that the GaAs surface covered with a few monolayers of Si can stand a much higher temperature, and the crystal quality of the Si is resumed during the high-temperature anneal. The surface morphology of the as-deposited and the in situ annealed Si was examined with a scanning tunneling microscope, the results of which confirmed high crystal quality of the Si layer and full coverage of the GaAs surface. With in situ anneal, interface trap densities of high 1010 eV-1 cm-2 were routinely obtained in Si3N4/Si/GaAs metal-insulator-semiconductor capacitors, as determined with conductance measurements.

Original languageEnglish (US)
Pages (from-to)4113-4115
Number of pages3
JournalJournal of Applied Physics
Volume77
Issue number8
DOIs
StatePublished - Dec 1 1995
Externally publishedYes

ASJC Scopus subject areas

  • Physics and Astronomy(all)

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    Tao, M., Botchkarev, A. E., Park, D., Reed, J., Chey, S. J., Van Nostrand, J. E., Cahill, D. G., & Morkoç, H. (1995). Improved Si3N4/Si/GaAs metal-insulator-semiconductor interfaces by in situ anneal of the as-deposited Si. Journal of Applied Physics, 77(8), 4113-4115. https://doi.org/10.1063/1.359495