@inproceedings{5ca37523d6a34e15bdaee2dab442de77,
title = "Impact of vertical RRAM device characteristics on 3D cross-point array design",
abstract = "Resistive switching random access memory (RRAM) is one of the most promising candidates for the next-generation non-volatile memory. To enable large capacity RRAM array, the 3D architecture is needed. In this work, the analyses of different device characteristics, including the RRAM ON/OFF-state resistance (Ron/Roff), I-V nonlinearity ratio and the interconnect material, are performed to find the optimal design point of the 3D RRAM array. The results show that insufficient current drivability of the vertical transistor causes a significant amount of voltage drop on the transistor. The write and read margin conflicts with each other. A high R on is preferred over a high nonlinearity to improve the write/read margin. A RRAM cell with Ron=500kΩ and nonlinearity=5x can satisfy the specified programming and read sense criterion for a 128×128×16 array, Moreover, the energy consumption (",
keywords = "3D vertical RRAM, Rom, cross-point array, energy consumption, feature size, interconnect, nonlinearity",
author = "Chen, {Pai Yu} and Shimeng Yu",
year = "2014",
month = jan,
day = "1",
doi = "10.1109/IMW.2014.6849382",
language = "English (US)",
isbn = "9781479935949",
series = "2014 IEEE 6th International Memory Workshop, IMW 2014",
publisher = "IEEE Computer Society",
booktitle = "2014 IEEE 6th International Memory Workshop, IMW 2014",
note = "2014 IEEE 6th International Memory Workshop, IMW 2014 ; Conference date: 18-05-2014 Through 21-05-2014",
}