Abstract
The ever-increasing demand for higher bandwidth and lower loss makes the predictability of high-speed interconnect performance increasingly challenging. Validating models against measurements of manufactured test structures requires not only accurate methodology but also understanding of the uncertainty impact. S-parameter measurements, characterization of materials, manufacturing processes, and models constructed based on measured inputs all cause uncertainty in the performance metrics of interest. Therefore, it is critical to anticipate the results with the associated uncertainty to assess the correlation quality more objectively. This article investigates the reproducibility of measurements required for high-speed package interconnect validation through rigorous analysis and presents a methodology to quantify the impact of measurement uncertainty on commonly used performance metrics.
Original language | English (US) |
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Article number | 9502117 |
Pages (from-to) | 1380-1390 |
Number of pages | 11 |
Journal | IEEE Transactions on Components, Packaging and Manufacturing Technology |
Volume | 11 |
Issue number | 9 |
DOIs | |
State | Published - Sep 2021 |
Keywords
- Correlation
- high-speed interconnects
- measurement uncertainty
- reproducibility
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering