Hybrid silicon/silicone (polydimethylsiloxane) microsystem for cell culture

Jennifer Blain Christen, Andreas G. Andreou

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

We discuss the design, fabrication and testing of a hybrid microsystem for stand-alone cell culture and incubation. The micro-incubator is engineered through the integration of a silicon CMOS die for the heater and temperature sensor, with multilayer silicone PDMS (polydimethylsiloxane) structures namely, fluidic channels and a 4mm diameter, 30μL, culture well. A 25 micron thick PDMS membrane covers the top of the culture well, acting as barrier to contaminants while allowing the cells to exchange gases with the ambient environment. The packaging for the microsystem includes a flexible polyimide electronic ribbon cable and four fluidic ports that provide external interfaces to electrical energy, closed loop sensing and electronic control as well as solid and liquid supplies. The complete structure has a size of (2.5×2.5×0.6cm3). We have employed the device to successfully culture BHK-21 cells autonomously over a sixty hour period in ambient environment.

Original languageEnglish (US)
Title of host publicationISCAS 2006
Subtitle of host publication2006 IEEE International Symposium on Circuits and Systems, Proceedings
Pages1135-1138
Number of pages4
StatePublished - Dec 1 2006
Externally publishedYes
EventISCAS 2006: 2006 IEEE International Symposium on Circuits and Systems - Kos, Greece
Duration: May 21 2006May 24 2006

Publication series

NameProceedings - IEEE International Symposium on Circuits and Systems
ISSN (Print)0271-4310

Other

OtherISCAS 2006: 2006 IEEE International Symposium on Circuits and Systems
CountryGreece
CityKos
Period5/21/065/24/06

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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    Christen, J. B., & Andreou, A. G. (2006). Hybrid silicon/silicone (polydimethylsiloxane) microsystem for cell culture. In ISCAS 2006: 2006 IEEE International Symposium on Circuits and Systems, Proceedings (pp. 1135-1138). [1692790] (Proceedings - IEEE International Symposium on Circuits and Systems).