Hybrid Flexible Electronics Integrating Rigid Integrated Circuits

Umit Ogras (Inventor)

Research output: Patent

Abstract

In recent years, consumer demand increased for flexible electronics since they are lighter, thinner, cheaper to manufacture, and more versatile in application than traditional rigid circuits. Flexible electronics have huge market potential, but lack size and performance efficiency compared to current silicon technology. To combat the inefficiencies of flexible electronics, scientists look to use integrated circuits (compact and performance-efficient circuits) to create a hybrid structure that is able to optimally balance elasticity and performance. Researchers at ASU have developed a theoretical basis for placing chips that retain favorable electrical and thermal properties on a flexible surface. The design has rigid circuits in the smallest bounding space with enough area for interconnects, allowing users to customize the chips balance between performance and flexibility. The placement of the chips on the flexible substrate minimizes distance between circuits and maximizes performance. Potential Applications Flexible/Wearable/Personal Electronics Semiconductors Processors Benefits and Advantages Hybrid Structure the method can efficiently and effectively balance pliability and performance Customizable allows tradeoff between performance and flexibility, letting users set an optimal balance as necessary Innovative the hybrid framework delves into an industry with huge market potential Download Original PDF For more information about the inventor(s) and their research, please see: Dr. Umit Ogras's directory webpage
Original languageEnglish (US)
StatePublished - Apr 27 2015

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Flexible electronics
Integrated circuits
Networks (circuits)
Elasticity
Electric properties
Electronic equipment
Thermodynamic properties
Semiconductor materials
Silicon
Substrates
Industry

Cite this

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