Abstract

The increasing integration of high performance processors and dense circuits in current computing devices has produced high heat flux in localized areas (hot spots) that limits their performance and reliability. To control the hot spots on a CPU, many researchers have focused on active cooling methods such as thermoelectric coolers (TECs) to avoid thermal emergencies. This paper presents the optimized thermoelectric modules on top of the CPU combined with a conventional air-cooling device to reduce the hot spot temperature and at the same time harvest waste heat energy generated by the CPU. To control the temperature of the hot spots, we attach small-sized TECs to the CPU and use thermoelectric generators (TEGs) placed on the rest of the CPU to convert waste heat energy into electricity. This study investigates design alternatives with an analytical model considering the non-uniform temperature distribution based on two-node thermal networks. The results indicate that we are able to attain more energy from the TEGs than energy consumption for running the TECs. In other words, we can allow the harvested heat energy to be reused to power other components and reduce hot spots simultaneously. Overall, the idea of simultaneous hot spot cooling and waste heat harvesting using thermoelectric modules on a CPU is a promising method to control the problem of heat generation and to reduce energy consumption in a computing device.

Original languageEnglish (US)
Title of host publicationASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
PublisherAmerican Society of Mechanical Engineers (ASME)
Volume10
DOIs
StatePublished - 2014
EventASME 2014 International Mechanical Engineering Congress and Exposition, IMECE 2014 - Montreal, Canada
Duration: Nov 14 2014Nov 20 2014

Other

OtherASME 2014 International Mechanical Engineering Congress and Exposition, IMECE 2014
CountryCanada
CityMontreal
Period11/14/1411/20/14

Fingerprint

Waste heat
Program processors
Cooling
Energy utilization
Heat generation
Heat flux
Analytical models
Temperature distribution
Electricity
Temperature
Networks (circuits)
Air
Hot Temperature

ASJC Scopus subject areas

  • Mechanical Engineering

Cite this

Lee, S., Phelan, P., & Wu, C-J. (2014). Hot spot cooling and harvesting CPU waste heat using thermoelectric modules. In ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) (Vol. 10). American Society of Mechanical Engineers (ASME). https://doi.org/10.1115/IMECE2014-36629

Hot spot cooling and harvesting CPU waste heat using thermoelectric modules. / Lee, Soochan; Phelan, Patrick; Wu, Carole-Jean.

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE). Vol. 10 American Society of Mechanical Engineers (ASME), 2014.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Lee, S, Phelan, P & Wu, C-J 2014, Hot spot cooling and harvesting CPU waste heat using thermoelectric modules. in ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE). vol. 10, American Society of Mechanical Engineers (ASME), ASME 2014 International Mechanical Engineering Congress and Exposition, IMECE 2014, Montreal, Canada, 11/14/14. https://doi.org/10.1115/IMECE2014-36629
Lee S, Phelan P, Wu C-J. Hot spot cooling and harvesting CPU waste heat using thermoelectric modules. In ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE). Vol. 10. American Society of Mechanical Engineers (ASME). 2014 https://doi.org/10.1115/IMECE2014-36629
Lee, Soochan ; Phelan, Patrick ; Wu, Carole-Jean. / Hot spot cooling and harvesting CPU waste heat using thermoelectric modules. ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE). Vol. 10 American Society of Mechanical Engineers (ASME), 2014.
@inproceedings{5531c523bdd24c1e9fb71d99be785c52,
title = "Hot spot cooling and harvesting CPU waste heat using thermoelectric modules",
abstract = "The increasing integration of high performance processors and dense circuits in current computing devices has produced high heat flux in localized areas (hot spots) that limits their performance and reliability. To control the hot spots on a CPU, many researchers have focused on active cooling methods such as thermoelectric coolers (TECs) to avoid thermal emergencies. This paper presents the optimized thermoelectric modules on top of the CPU combined with a conventional air-cooling device to reduce the hot spot temperature and at the same time harvest waste heat energy generated by the CPU. To control the temperature of the hot spots, we attach small-sized TECs to the CPU and use thermoelectric generators (TEGs) placed on the rest of the CPU to convert waste heat energy into electricity. This study investigates design alternatives with an analytical model considering the non-uniform temperature distribution based on two-node thermal networks. The results indicate that we are able to attain more energy from the TEGs than energy consumption for running the TECs. In other words, we can allow the harvested heat energy to be reused to power other components and reduce hot spots simultaneously. Overall, the idea of simultaneous hot spot cooling and waste heat harvesting using thermoelectric modules on a CPU is a promising method to control the problem of heat generation and to reduce energy consumption in a computing device.",
author = "Soochan Lee and Patrick Phelan and Carole-Jean Wu",
year = "2014",
doi = "10.1115/IMECE2014-36629",
language = "English (US)",
volume = "10",
booktitle = "ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)",
publisher = "American Society of Mechanical Engineers (ASME)",

}

TY - GEN

T1 - Hot spot cooling and harvesting CPU waste heat using thermoelectric modules

AU - Lee, Soochan

AU - Phelan, Patrick

AU - Wu, Carole-Jean

PY - 2014

Y1 - 2014

N2 - The increasing integration of high performance processors and dense circuits in current computing devices has produced high heat flux in localized areas (hot spots) that limits their performance and reliability. To control the hot spots on a CPU, many researchers have focused on active cooling methods such as thermoelectric coolers (TECs) to avoid thermal emergencies. This paper presents the optimized thermoelectric modules on top of the CPU combined with a conventional air-cooling device to reduce the hot spot temperature and at the same time harvest waste heat energy generated by the CPU. To control the temperature of the hot spots, we attach small-sized TECs to the CPU and use thermoelectric generators (TEGs) placed on the rest of the CPU to convert waste heat energy into electricity. This study investigates design alternatives with an analytical model considering the non-uniform temperature distribution based on two-node thermal networks. The results indicate that we are able to attain more energy from the TEGs than energy consumption for running the TECs. In other words, we can allow the harvested heat energy to be reused to power other components and reduce hot spots simultaneously. Overall, the idea of simultaneous hot spot cooling and waste heat harvesting using thermoelectric modules on a CPU is a promising method to control the problem of heat generation and to reduce energy consumption in a computing device.

AB - The increasing integration of high performance processors and dense circuits in current computing devices has produced high heat flux in localized areas (hot spots) that limits their performance and reliability. To control the hot spots on a CPU, many researchers have focused on active cooling methods such as thermoelectric coolers (TECs) to avoid thermal emergencies. This paper presents the optimized thermoelectric modules on top of the CPU combined with a conventional air-cooling device to reduce the hot spot temperature and at the same time harvest waste heat energy generated by the CPU. To control the temperature of the hot spots, we attach small-sized TECs to the CPU and use thermoelectric generators (TEGs) placed on the rest of the CPU to convert waste heat energy into electricity. This study investigates design alternatives with an analytical model considering the non-uniform temperature distribution based on two-node thermal networks. The results indicate that we are able to attain more energy from the TEGs than energy consumption for running the TECs. In other words, we can allow the harvested heat energy to be reused to power other components and reduce hot spots simultaneously. Overall, the idea of simultaneous hot spot cooling and waste heat harvesting using thermoelectric modules on a CPU is a promising method to control the problem of heat generation and to reduce energy consumption in a computing device.

UR - http://www.scopus.com/inward/record.url?scp=84926333131&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84926333131&partnerID=8YFLogxK

U2 - 10.1115/IMECE2014-36629

DO - 10.1115/IMECE2014-36629

M3 - Conference contribution

VL - 10

BT - ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

PB - American Society of Mechanical Engineers (ASME)

ER -