High volume rate, high resolution 3D plane wave imaging

Ming Yang, Richard Sampson, Siyuan Wei, Thomas F. Wenisch, Brian Fowlkes, Oliver Kripfgans, Chaitali Chakrabarti

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Scopus citations

Abstract

3D plane-wave imaging systems can support the high volume acquisition rates that are essential for 3D vector flow imaging and sonoelastography but suffer from low resolution and low SNR. Coherent compounding is a technique to improve the image quality of plane-wave systems at the expense of significant increase in beamforming computational complexity. In this paper, we propose a new separable beamforming method for 3D plane-wave imaging with coherent compounding that has computational complexity comparable to that of a non-separable non-compounding baseline system. The new method with 9-fire-angle compounding helps improve average CNR from 1.6 to 2.2 and achieve a SNR increase of 9.0 dB compared to the baseline system. We also propose several enhancements to our beamforming accelerator, Sonic Millip3De, including additional SRAM arrays, configurable interconnect, and embedded DRAM. Overall, our system is capable of generating high resolution images at 1000 volumes per second.

Original languageEnglish (US)
Title of host publicationIEEE International Ultrasonics Symposium, IUS
PublisherIEEE Computer Society
Pages1253-1256
Number of pages4
ISBN (Electronic)9781479970490
DOIs
StatePublished - Oct 20 2014
Event2014 IEEE International Ultrasonics Symposium, IUS 2014 - Chicago, United States
Duration: Sep 3 2014Sep 6 2014

Publication series

NameIEEE International Ultrasonics Symposium, IUS
ISSN (Print)1948-5719
ISSN (Electronic)1948-5727

Other

Other2014 IEEE International Ultrasonics Symposium, IUS 2014
CountryUnited States
CityChicago
Period9/3/149/6/14

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ASJC Scopus subject areas

  • Acoustics and Ultrasonics

Cite this

Yang, M., Sampson, R., Wei, S., Wenisch, T. F., Fowlkes, B., Kripfgans, O., & Chakrabarti, C. (2014). High volume rate, high resolution 3D plane wave imaging. In IEEE International Ultrasonics Symposium, IUS (pp. 1253-1256). [6932360] (IEEE International Ultrasonics Symposium, IUS). IEEE Computer Society. https://doi.org/10.1109/ULTSYM.2014.0309