High-volume-rate 3-d ultrasound imaging based on synthetic aperture sequential beamforming with chirp-coded excitation

Jian Zhou, Siyuan Wei, Rungroj Jintamethasawat, Richard Sampson, Oliver D. Kripfgans, J. Brian Fowlkes, Thomas F. Wenisch, Chaitali Chakrabarti

Research output: Contribution to journalArticle

Abstract

Three-dimensional (3-D) ultrasound imaging is a promising modality for many medical applications. Unfortunately, it generates voluminous data in the front end, making it unattractive for high-volume-rate portable medical applications. We apply synthetic aperture sequential beamforming (SASB) to greatly compress the front-end receive data. Baseline 3-D SASB has a low volume rate, because subapertures fire one by one. In this paper, we propose to increase the volume rate of 3-D SASB without degrading imaging quality through: 1) transmitting and receiving simultaneously with four subapertures and 2) using linear chirps as the excitation waveform to reduce interference. We design four linear chirps that operate on two overlapped frequency bands with chirp pairs in each band having opposite chirp rates. Direct implementation of this firing scheme results in grating lobes. Therefore, we design a sparse array that mitigates the grating lobe levels through optimizing the locations of transducer elements in the bin-based random array. Compared with the baseline 3-D SASB, the proposed method increases the volume rate from 8.56 to 34.2 volumes/s without increasing the front-end computation requirement. Field-II-based cyst simulations show that the proposed method achieves imaging quality comparable with baseline 3-D SASB in both shallow and deep regions.

Original languageEnglish (US)
Pages (from-to)1346-1358
Number of pages13
JournalIEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
Volume65
Issue number8
DOIs
StatePublished - Aug 2018

Keywords

  • 3-D ultrasound imaging
  • chirp-coded excitation
  • sparse array
  • synthetic aperture sequential beamforming (SASB)

ASJC Scopus subject areas

  • Instrumentation
  • Acoustics and Ultrasonics
  • Electrical and Electronic Engineering

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