Abstract
We describe the use of a p-type refractory ohmic contact in ohmic self-aligned devices. The contacts are based on self-aligned diffusion of zinc-doped tungsten film. The diffusion is nearly isotropic in the vicinity of silicon nitride sidewalls, allowing self-alignment of ohmic contacts with emitters and gates. Lowresistance contacts (< 10-6 Ω. cm2) are formed both to GaAs and GaAIAs, and the lifetime of the diffused region is superior to that obtained from implantation. Heterostructure bipolar transistors (HBT's) showing high current gains (≥50 at 2 x 103 A.cm-2 and ≥200 at 1 x 105 A.cm-2 with micrometer-sized emitter widths) and p-channel GaAs gate heterostructure field-effect transistors (HFET's) showing high transconductances (78 mS/mm at 2.2-μm gate length) have been fabricated using this contact.
Original language | English (US) |
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Pages (from-to) | 422-424 |
Number of pages | 3 |
Journal | IEEE Electron Device Letters |
Volume | 9 |
Issue number | 8 |
DOIs | |
State | Published - Aug 1988 |
Externally published | Yes |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering