GTX: the MARCO GSRC technology extrapolation system

Andrew E. Caldwell, Yu Cao, Andrew B. Kahng, Farinaz Koushanfar, Hua Lu, Igor L. Markov, Michael Oliver, Dirk Stroobandt, Dennis Sylvester

Research output: Chapter in Book/Report/Conference proceedingConference contribution

30 Scopus citations

Abstract

Technology extrapolation - the calibration and prediction of achievable design in future technology generations - drives the evolution of VLSI system architectures, design methodologies, and design tools. This paper describes initial experiences with development and use of GTX, the MARCO GSRC Technology Extrapolation system. GTX provides a robust, portable framework for interactive specification and comparison of modeling choices, e.g., for predicting system cycle time, die size and power dissipation. We use GTX to reveal surprising levels of uncertainty (modeling and parameter sensitivity) in widely-cited cycle-time models that drive recent roadmaps. We also describe new SOI and bulk device models that have been developed for GTX, as well as studies of power dissipation and delay uncertainty under various implementation assumptions for global interconnects.

Original languageEnglish (US)
Title of host publicationProceedings - Design Automation Conference
PublisherIEEE
Pages693-698
Number of pages6
StatePublished - 2000
Externally publishedYes
EventDAC 2000: 37th Design Automation Conference - Los Angeles, CA, USA
Duration: Jun 5 2000Jun 9 2000

Other

OtherDAC 2000: 37th Design Automation Conference
CityLos Angeles, CA, USA
Period6/5/006/9/00

ASJC Scopus subject areas

  • Hardware and Architecture
  • Control and Systems Engineering

Fingerprint Dive into the research topics of 'GTX: the MARCO GSRC technology extrapolation system'. Together they form a unique fingerprint.

  • Cite this

    Caldwell, A. E., Cao, Y., Kahng, A. B., Koushanfar, F., Lu, H., Markov, I. L., Oliver, M., Stroobandt, D., & Sylvester, D. (2000). GTX: the MARCO GSRC technology extrapolation system. In Proceedings - Design Automation Conference (pp. 693-698). IEEE.