Abstract
TEM analysis and in-situ isothermal aging were conducted to investigate the growth kinetics of the θ-phase in Al-Cu thin films. It was observed that as t 0.24 for the initial growth period up to 10 to 20 min aging at temperatures between 250 and 300°C, the lengthening of θ precipitates varies. This is in reasonable agreement with the t 1/4 time law for bulk alloys. At longer annealing times, the theory does not fit because the distances of Cu volume diffusion exceed the film half thickness.
| Original language | English (US) |
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| Title of host publication | Proceedings - Annual Meeting, Microscopy Society of America |
| Publisher | Publ by San Francisco Press Inc |
| Pages | 1172-1173 |
| Number of pages | 2 |
| State | Published - 1993 |
| Event | Proceedings of the 51st Annual Meeting Microscopy Society of America - Cincinnati, OH, USA Duration: Aug 1 1993 → Aug 6 1993 |
Other
| Other | Proceedings of the 51st Annual Meeting Microscopy Society of America |
|---|---|
| City | Cincinnati, OH, USA |
| Period | 8/1/93 → 8/6/93 |
ASJC Scopus subject areas
- General Engineering