Growth kinetics of Al 2Cu in an Al-1.5Cu thin film by in situ TEM

M. Park, Stephen Krause, S. R. Wilson

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

TEM analysis and in-situ isothermal aging were conducted to investigate the growth kinetics of the θ-phase in Al-Cu thin films. It was observed that as t 0.24 for the initial growth period up to 10 to 20 min aging at temperatures between 250 and 300°C, the lengthening of θ precipitates varies. This is in reasonable agreement with the t 1/4 time law for bulk alloys. At longer annealing times, the theory does not fit because the distances of Cu volume diffusion exceed the film half thickness.

Original languageEnglish (US)
Title of host publicationProceedings - Annual Meeting, Microscopy Society of America
PublisherPubl by San Francisco Press Inc
Pages1172-1173
Number of pages2
StatePublished - 1993
EventProceedings of the 51st Annual Meeting Microscopy Society of America - Cincinnati, OH, USA
Duration: Aug 1 1993Aug 6 1993

Other

OtherProceedings of the 51st Annual Meeting Microscopy Society of America
CityCincinnati, OH, USA
Period8/1/938/6/93

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Growth kinetics
Aging of materials
Transmission electron microscopy
Thin films
Precipitates
Annealing
Temperature

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Park, M., Krause, S., & Wilson, S. R. (1993). Growth kinetics of Al 2Cu in an Al-1.5Cu thin film by in situ TEM In Proceedings - Annual Meeting, Microscopy Society of America (pp. 1172-1173). Publ by San Francisco Press Inc.

Growth kinetics of Al 2Cu in an Al-1.5Cu thin film by in situ TEM . / Park, M.; Krause, Stephen; Wilson, S. R.

Proceedings - Annual Meeting, Microscopy Society of America. Publ by San Francisco Press Inc, 1993. p. 1172-1173.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Park, M, Krause, S & Wilson, SR 1993, Growth kinetics of Al 2Cu in an Al-1.5Cu thin film by in situ TEM in Proceedings - Annual Meeting, Microscopy Society of America. Publ by San Francisco Press Inc, pp. 1172-1173, Proceedings of the 51st Annual Meeting Microscopy Society of America, Cincinnati, OH, USA, 8/1/93.
Park M, Krause S, Wilson SR. Growth kinetics of Al 2Cu in an Al-1.5Cu thin film by in situ TEM In Proceedings - Annual Meeting, Microscopy Society of America. Publ by San Francisco Press Inc. 1993. p. 1172-1173
Park, M. ; Krause, Stephen ; Wilson, S. R. / Growth kinetics of Al 2Cu in an Al-1.5Cu thin film by in situ TEM Proceedings - Annual Meeting, Microscopy Society of America. Publ by San Francisco Press Inc, 1993. pp. 1172-1173
@inproceedings{4d1364d2deb64369b79f766b460e792a,
title = "Growth kinetics of Al 2Cu in an Al-1.5Cu thin film by in situ TEM",
abstract = "TEM analysis and in-situ isothermal aging were conducted to investigate the growth kinetics of the θ-phase in Al-Cu thin films. It was observed that as t 0.24 for the initial growth period up to 10 to 20 min aging at temperatures between 250 and 300°C, the lengthening of θ precipitates varies. This is in reasonable agreement with the t 1/4 time law for bulk alloys. At longer annealing times, the theory does not fit because the distances of Cu volume diffusion exceed the film half thickness.",
author = "M. Park and Stephen Krause and Wilson, {S. R.}",
year = "1993",
language = "English (US)",
pages = "1172--1173",
booktitle = "Proceedings - Annual Meeting, Microscopy Society of America",
publisher = "Publ by San Francisco Press Inc",

}

TY - GEN

T1 - Growth kinetics of Al 2Cu in an Al-1.5Cu thin film by in situ TEM

AU - Park, M.

AU - Krause, Stephen

AU - Wilson, S. R.

PY - 1993

Y1 - 1993

N2 - TEM analysis and in-situ isothermal aging were conducted to investigate the growth kinetics of the θ-phase in Al-Cu thin films. It was observed that as t 0.24 for the initial growth period up to 10 to 20 min aging at temperatures between 250 and 300°C, the lengthening of θ precipitates varies. This is in reasonable agreement with the t 1/4 time law for bulk alloys. At longer annealing times, the theory does not fit because the distances of Cu volume diffusion exceed the film half thickness.

AB - TEM analysis and in-situ isothermal aging were conducted to investigate the growth kinetics of the θ-phase in Al-Cu thin films. It was observed that as t 0.24 for the initial growth period up to 10 to 20 min aging at temperatures between 250 and 300°C, the lengthening of θ precipitates varies. This is in reasonable agreement with the t 1/4 time law for bulk alloys. At longer annealing times, the theory does not fit because the distances of Cu volume diffusion exceed the film half thickness.

UR - http://www.scopus.com/inward/record.url?scp=0027707796&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0027707796&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0027707796

SP - 1172

EP - 1173

BT - Proceedings - Annual Meeting, Microscopy Society of America

PB - Publ by San Francisco Press Inc

ER -