Growth kinetics of Al 2Cu in an Al-1.5Cu thin film by in situ TEM

M. Park, Stephen Krause, S. R. Wilson

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

TEM analysis and in-situ isothermal aging were conducted to investigate the growth kinetics of the θ-phase in Al-Cu thin films. It was observed that as t 0.24 for the initial growth period up to 10 to 20 min aging at temperatures between 250 and 300°C, the lengthening of θ precipitates varies. This is in reasonable agreement with the t 1/4 time law for bulk alloys. At longer annealing times, the theory does not fit because the distances of Cu volume diffusion exceed the film half thickness.

Original languageEnglish (US)
Title of host publicationProceedings - Annual Meeting, Microscopy Society of America
PublisherPubl by San Francisco Press Inc
Pages1172-1173
Number of pages2
StatePublished - 1993
EventProceedings of the 51st Annual Meeting Microscopy Society of America - Cincinnati, OH, USA
Duration: Aug 1 1993Aug 6 1993

Other

OtherProceedings of the 51st Annual Meeting Microscopy Society of America
CityCincinnati, OH, USA
Period8/1/938/6/93

ASJC Scopus subject areas

  • Engineering(all)

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    Park, M., Krause, S., & Wilson, S. R. (1993). Growth kinetics of Al 2Cu in an Al-1.5Cu thin film by in situ TEM In Proceedings - Annual Meeting, Microscopy Society of America (pp. 1172-1173). Publ by San Francisco Press Inc.