Glass air-gap transmission lines on silicon for microwave integrated circuits

Jeff C P Chuang; Samir M. El-Ghazaly; Yong-Hang Zhang

Glass air-gap transmission lines on silicon for microwave integrated circuits

Jeff C P Chuang, Samir M. El-Ghazaly, Yong-Hang Zhang

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Two types of air-gap transmission-line structures on silicon substrates have been fabricated using glass microbump bonding (GMBB) techniques. The air-gap transmission lines have the advantages of lower losses compare to conventional uniplanar transmission-line on doped semiconductor substrate. Because the bonding techniques are simple, this integration approach provides a cost-effective solution for monolithic microwave integrated circuits (MMICs). Theoretical and experimental results of air-gap interconnects on silicon substrate are presented in this paper. Spiral inductors fabricated in air-gap configurations are also experimentally studied. The temperature effects on losses are investigated as well.

Original language	English (US)
Title of host publication	Conference Proceedings - European Microwave Conference
Place of Publication	Turnbridge Wells, United Kingdom
Publisher	Microwave Exhibitions & Publ Ltd
Pages	1014-1019
Number of pages	6
Volume	2
State	Published - 1997
Event	Proceedings of the 1997 27th European Microwave Conference. Part 2 (of 2) - Jerusalem, Isr Duration: Sep 8 1997 → Sep 12 1997

Other

Other	Proceedings of the 1997 27th European Microwave Conference. Part 2 (of 2)
City	Jerusalem, Isr
Period	9/8/97 → 9/12/97

ASJC Scopus subject areas

General Engineering
Computer Networks and Communications
Hardware and Architecture
Electrical and Electronic Engineering

Cite this

Glass air-gap transmission lines on silicon for microwave integrated circuits. / Chuang, Jeff C P; El-Ghazaly, Samir M.; Zhang, Yong-Hang.
Conference Proceedings - European Microwave Conference. Vol. 2 Turnbridge Wells, United Kingdom: Microwave Exhibitions & Publ Ltd, 1997. p. 1014-1019.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Chuang, JCP, El-Ghazaly, SM & Zhang, Y-H 1997, Glass air-gap transmission lines on silicon for microwave integrated circuits. in Conference Proceedings - European Microwave Conference. vol. 2, Microwave Exhibitions & Publ Ltd, Turnbridge Wells, United Kingdom, pp. 1014-1019, Proceedings of the 1997 27th European Microwave Conference. Part 2 (of 2), Jerusalem, Isr, 9/8/97.

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abstract = "Two types of air-gap transmission-line structures on silicon substrates have been fabricated using glass microbump bonding (GMBB) techniques. The air-gap transmission lines have the advantages of lower losses compare to conventional uniplanar transmission-line on doped semiconductor substrate. Because the bonding techniques are simple, this integration approach provides a cost-effective solution for monolithic microwave integrated circuits (MMICs). Theoretical and experimental results of air-gap interconnects on silicon substrate are presented in this paper. Spiral inductors fabricated in air-gap configurations are also experimentally studied. The temperature effects on losses are investigated as well.",

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N2 - Two types of air-gap transmission-line structures on silicon substrates have been fabricated using glass microbump bonding (GMBB) techniques. The air-gap transmission lines have the advantages of lower losses compare to conventional uniplanar transmission-line on doped semiconductor substrate. Because the bonding techniques are simple, this integration approach provides a cost-effective solution for monolithic microwave integrated circuits (MMICs). Theoretical and experimental results of air-gap interconnects on silicon substrate are presented in this paper. Spiral inductors fabricated in air-gap configurations are also experimentally studied. The temperature effects on losses are investigated as well.

AB - Two types of air-gap transmission-line structures on silicon substrates have been fabricated using glass microbump bonding (GMBB) techniques. The air-gap transmission lines have the advantages of lower losses compare to conventional uniplanar transmission-line on doped semiconductor substrate. Because the bonding techniques are simple, this integration approach provides a cost-effective solution for monolithic microwave integrated circuits (MMICs). Theoretical and experimental results of air-gap interconnects on silicon substrate are presented in this paper. Spiral inductors fabricated in air-gap configurations are also experimentally studied. The temperature effects on losses are investigated as well.

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BT - Conference Proceedings - European Microwave Conference

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T2 - Proceedings of the 1997 27th European Microwave Conference. Part 2 (of 2)

Y2 - 8 September 1997 through 12 September 1997

ER -

Glass air-gap transmission lines on silicon for microwave integrated circuits

Abstract

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