Glass air-gap transmission lines on silicon for microwave integrated circuits

Jeff C P Chuang, Samir M. El-Ghazaly, Yong-Hang Zhang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Two types of air-gap transmission-line structures on silicon substrates have been fabricated using glass microbump bonding (GMBB) techniques. The air-gap transmission lines have the advantages of lower losses compare to conventional uniplanar transmission-line on doped semiconductor substrate. Because the bonding techniques are simple, this integration approach provides a cost-effective solution for monolithic microwave integrated circuits (MMICs). Theoretical and experimental results of air-gap interconnects on silicon substrate are presented in this paper. Spiral inductors fabricated in air-gap configurations are also experimentally studied. The temperature effects on losses are investigated as well.

Original languageEnglish (US)
Title of host publicationConference Proceedings - European Microwave Conference
Place of PublicationTurnbridge Wells, United Kingdom
PublisherMicrowave Exhibitions & Publ Ltd
Pages1014-1019
Number of pages6
Volume2
StatePublished - 1997
EventProceedings of the 1997 27th European Microwave Conference. Part 2 (of 2) - Jerusalem, Isr
Duration: Sep 8 1997Sep 12 1997

Other

OtherProceedings of the 1997 27th European Microwave Conference. Part 2 (of 2)
CityJerusalem, Isr
Period9/8/979/12/97

ASJC Scopus subject areas

  • Engineering(all)
  • Computer Networks and Communications
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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  • Cite this

    Chuang, J. C. P., El-Ghazaly, S. M., & Zhang, Y-H. (1997). Glass air-gap transmission lines on silicon for microwave integrated circuits. In Conference Proceedings - European Microwave Conference (Vol. 2, pp. 1014-1019). Microwave Exhibitions & Publ Ltd.