Geometry of damage in shock loaded copper and tantalum

D. L. Tonks, J. Bingert, V. Livescu, Pedro Peralta

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

Cavities of coalesced voids have been found in recovered samples of Tantalum in high-explosive-driven experiments. The boundaries of these cavities are imprinted with details of the coalescence and void growth processes. One way of quantifying these details is to measure the roughness of the surfaces. In this work, we calculate the roughness of 2D cross sections of such cavity surfaces from micrographs by analyzing the images with the box counting technique. Spall plane damage driven by flyer plates in Copper samples is also analyzed. The different length scale regimes found will be discussed.

Original languageEnglish (US)
Title of host publicationShock Compression of Condensed Matter - 2009 - Proceedings of the Conference of the American Physical Society Topical Group on Shock Compression of Condensed Matter
Pages1081-1084
Number of pages4
DOIs
StatePublished - Dec 1 2009
EventConference of the American Physical Society Topical Group on Shock Compression of Condensed Matter, 2009 APS SCCM - Nashville, TN, United States
Duration: Jun 28 2009Jul 3 2009

Publication series

NameAIP Conference Proceedings
Volume1195
ISSN (Print)0094-243X
ISSN (Electronic)1551-7616

Other

OtherConference of the American Physical Society Topical Group on Shock Compression of Condensed Matter, 2009 APS SCCM
CountryUnited States
CityNashville, TN
Period6/28/097/3/09

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Keywords

  • Copper
  • Ductile damage
  • Roughness
  • Spallation
  • Tantalum

ASJC Scopus subject areas

  • Physics and Astronomy(all)

Cite this

Tonks, D. L., Bingert, J., Livescu, V., & Peralta, P. (2009). Geometry of damage in shock loaded copper and tantalum. In Shock Compression of Condensed Matter - 2009 - Proceedings of the Conference of the American Physical Society Topical Group on Shock Compression of Condensed Matter (pp. 1081-1084). (AIP Conference Proceedings; Vol. 1195). https://doi.org/10.1063/1.3294989