Abstract
Cu<inf>6</inf>Sn<inf>5</inf> intermetallic is an important compound formed during reaction between Sn-rich interconnects and copper metallization. The full elastic constants of Cu<inf>6</inf>Sn<inf>5</inf> were quantified experimentally by Resonant Ultrasound Spectroscopy (RUS). The single crystal elastic properties were modeled by density functional theory. A mesoscale polycrystalline model, incorporating the single crystal constants was compared to the experimental results, yielding excellent agreement.
Original language | English (US) |
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Journal | Scripta Materialia |
DOIs | |
State | Accepted/In press - May 7 2015 |
Keywords
- Ab initio
- Cu<inf>6</inf>Sn<inf>5</inf>
- Elastic properties
- Intermetallic
- Resonant Ultrasound Spectroscopy
ASJC Scopus subject areas
- Materials Science(all)
- Condensed Matter Physics