Full elastic constants of Cu<inf>6</inf>Sn<inf>5</inf> intermetallic by Resonant Ultrasound Spectroscopy (RUS) and ab initio calculations

L. Jiang, N. Muthegowda, M. A. Bhatia, A. Migliori, Kiran Solanki, Nikhilesh Chawla

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

Cu<inf>6</inf>Sn<inf>5</inf> intermetallic is an important compound formed during reaction between Sn-rich interconnects and copper metallization. The full elastic constants of Cu<inf>6</inf>Sn<inf>5</inf> were quantified experimentally by Resonant Ultrasound Spectroscopy (RUS). The single crystal elastic properties were modeled by density functional theory. A mesoscale polycrystalline model, incorporating the single crystal constants was compared to the experimental results, yielding excellent agreement.

Original languageEnglish (US)
JournalScripta Materialia
DOIs
StateAccepted/In press - May 7 2015

Fingerprint

Elastic constants
Intermetallics
intermetallics
elastic properties
Ultrasonics
Single crystals
Spectroscopy
single crystals
Metallizing
spectroscopy
Density functional theory
Copper
density functional theory
copper

Keywords

  • Ab initio
  • Cu<inf>6</inf>Sn<inf>5</inf>
  • Elastic properties
  • Intermetallic
  • Resonant Ultrasound Spectroscopy

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics

Cite this

Full elastic constants of Cu<inf>6</inf>Sn<inf>5</inf> intermetallic by Resonant Ultrasound Spectroscopy (RUS) and ab initio calculations. / Jiang, L.; Muthegowda, N.; Bhatia, M. A.; Migliori, A.; Solanki, Kiran; Chawla, Nikhilesh.

In: Scripta Materialia, 07.05.2015.

Research output: Contribution to journalArticle

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AU - Solanki, Kiran

AU - Chawla, Nikhilesh

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