Formation of nanogaps by nanoscale Cu electrodeposition and dissolution

Fang Chen, Quan Qing, Liang Ren, Lianming Tong, Zhongyun Wu, Zhongfan Liu

Research output: Contribution to journalArticlepeer-review

6 Scopus citations

Abstract

We utilize an ac feedback signal to control the size of Cu nanogaps by electrochemically depositing or dissolving copper onto pre-patterned electrodes. The ac frequency in this work was set to 820 Hz, at which the capacitive reactance contributes notably to the gap impedance. As a result, distinct changes can be observed in the monitored signals at relatively large gap size, as compared with the high sensitivity of resistive reactance to small gap distance when the frequency is set lower. Within the present parameter, we have prepared nanoscale gaps ranging from tens of nm to sub-10 nm by carefully choosing the subsequent deposition or dissolution time.

Original languageEnglish (US)
Pages (from-to)4210-4214
Number of pages5
JournalElectrochimica Acta
Volume52
Issue number12
DOIs
StatePublished - Mar 10 2007

Keywords

  • Electrodeposition
  • Feedback
  • Impedance
  • Nanogap electrodes

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Electrochemistry

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