Flip-chip based packaging for linear ratcheting microactuators enables 3d stacks of moveble microelectrodes for the brain

J. Sutanto, S. Anand, R. Korb, L. Zhou, M. Okandan, M. Baker, Jitendran Muthuswamy

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

MEMS based movable microelectrodes now offer the exciting possibility of developing a fully autonomous implantable neural prosthetic system. However, critical interconnect and packaging challenges remain. We report here a novel flip-chip based interconnect and packaging approach for the implantable MEMS microelectrodes with complex moving structures on the die. The proposed approach is chip-scale, versatile (applicable to a variety of substrates and dies), scalable (allowing the realization of 3D stacks), and low-cost. We report here successful in vivo testing of this non-hermetically encapsulated flip-chip based package in long-term rodent experiments.

Original languageEnglish (US)
Title of host publication2012 Solid-State Sensors, Actuators and Microsystems Workshop, Hilton Head 2012
EditorsMehran Mehregany, David J. Monk
PublisherTransducer Research Foundation
Pages157-160
Number of pages4
ISBN (Electronic)9780964002494
DOIs
StatePublished - 2012
Event2012 Solid-State Sensors, Actuators and Microsystems Workshop, Hilton Head 2012 - Hilton Head, United States
Duration: Jun 3 2012Jun 7 2012

Publication series

NameTechnical Digest - Solid-State Sensors, Actuators, and Microsystems Workshop

Other

Other2012 Solid-State Sensors, Actuators and Microsystems Workshop, Hilton Head 2012
Country/TerritoryUnited States
CityHilton Head
Period6/3/126/7/12

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering
  • Hardware and Architecture

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