Flip-chip based packaging for linear ratcheting microactuators enables 3d stacks of moveble microelectrodes for the brain

J. Sutanto, S. Anand, R. Korb, L. Zhou, M. Okandan, M. Baker, Jitendran Muthuswamy

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

MEMS based movable microelectrodes now offer the exciting possibility of developing a fully autonomous implantable neural prosthetic system. However, critical interconnect and packaging challenges remain. We report here a novel flip-chip based interconnect and packaging approach for the implantable MEMS microelectrodes with complex moving structures on the die. The proposed approach is chip-scale, versatile (applicable to a variety of substrates and dies), scalable (allowing the realization of 3D stacks), and low-cost. We report here successful in vivo testing of this non-hermetically encapsulated flip-chip based package in long-term rodent experiments.

Original languageEnglish (US)
Title of host publicationTechnical Digest - Solid-State Sensors, Actuators, and Microsystems Workshop
PublisherTransducer Research Foundation
Pages157-160
Number of pages4
ISBN (Print)9780964002494
StatePublished - 2012
Event2012 Solid-State Sensors, Actuators and Microsystems Workshop, Hilton Head 2012 - Hilton Head, United States
Duration: Jun 3 2012Jun 7 2012

Other

Other2012 Solid-State Sensors, Actuators and Microsystems Workshop, Hilton Head 2012
CountryUnited States
CityHilton Head
Period6/3/126/7/12

Fingerprint

Microactuators
Microelectrodes
MEMS
Brain
Packaging
Prosthetics
Testing
Substrates
Costs
Experiments
Rodentia

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering
  • Hardware and Architecture

Cite this

Sutanto, J., Anand, S., Korb, R., Zhou, L., Okandan, M., Baker, M., & Muthuswamy, J. (2012). Flip-chip based packaging for linear ratcheting microactuators enables 3d stacks of moveble microelectrodes for the brain. In Technical Digest - Solid-State Sensors, Actuators, and Microsystems Workshop (pp. 157-160). Transducer Research Foundation.

Flip-chip based packaging for linear ratcheting microactuators enables 3d stacks of moveble microelectrodes for the brain. / Sutanto, J.; Anand, S.; Korb, R.; Zhou, L.; Okandan, M.; Baker, M.; Muthuswamy, Jitendran.

Technical Digest - Solid-State Sensors, Actuators, and Microsystems Workshop. Transducer Research Foundation, 2012. p. 157-160.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sutanto, J, Anand, S, Korb, R, Zhou, L, Okandan, M, Baker, M & Muthuswamy, J 2012, Flip-chip based packaging for linear ratcheting microactuators enables 3d stacks of moveble microelectrodes for the brain. in Technical Digest - Solid-State Sensors, Actuators, and Microsystems Workshop. Transducer Research Foundation, pp. 157-160, 2012 Solid-State Sensors, Actuators and Microsystems Workshop, Hilton Head 2012, Hilton Head, United States, 6/3/12.
Sutanto J, Anand S, Korb R, Zhou L, Okandan M, Baker M et al. Flip-chip based packaging for linear ratcheting microactuators enables 3d stacks of moveble microelectrodes for the brain. In Technical Digest - Solid-State Sensors, Actuators, and Microsystems Workshop. Transducer Research Foundation. 2012. p. 157-160
Sutanto, J. ; Anand, S. ; Korb, R. ; Zhou, L. ; Okandan, M. ; Baker, M. ; Muthuswamy, Jitendran. / Flip-chip based packaging for linear ratcheting microactuators enables 3d stacks of moveble microelectrodes for the brain. Technical Digest - Solid-State Sensors, Actuators, and Microsystems Workshop. Transducer Research Foundation, 2012. pp. 157-160
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