TY - GEN
T1 - Flexible thin film transistor arrays as an enabling platform technology
T2 - 3rd International Conference on Semiconductor Technology for Ultra Large Integrated Circuits and Thin Film Transistors, ULSIC vs. TFT III
AU - Raupp, G. B.
PY - 2011
Y1 - 2011
N2 - Significant advances in large-area flexible electronics over the last decade have created a tremendous opportunity for revolutionary transformational engineered products and systems with unique and desirable form, fit and function. In these "Flexible Systems", materials and nano-, micro-, and macro-scale devices are integrated to produce valuable multi-functional products that are characteristically thin, lightweight, flexible, conformable, and ultra-rugged for use under challenging conditions. The practical opportunities seem limitless: one can envision new dual-use technologies that can be deployed to address critical needs in a diverse application space from health sciences to information and decision technology, security and emergency response, transportation, energy and the environment. Before this compelling future is realized, however, major advances in three critical areas must be achieved: (i) design and integration; (ii) flexcompatible materials, structures and devices; and (iii) scaleable and sustainable manufacturing processes.
AB - Significant advances in large-area flexible electronics over the last decade have created a tremendous opportunity for revolutionary transformational engineered products and systems with unique and desirable form, fit and function. In these "Flexible Systems", materials and nano-, micro-, and macro-scale devices are integrated to produce valuable multi-functional products that are characteristically thin, lightweight, flexible, conformable, and ultra-rugged for use under challenging conditions. The practical opportunities seem limitless: one can envision new dual-use technologies that can be deployed to address critical needs in a diverse application space from health sciences to information and decision technology, security and emergency response, transportation, energy and the environment. Before this compelling future is realized, however, major advances in three critical areas must be achieved: (i) design and integration; (ii) flexcompatible materials, structures and devices; and (iii) scaleable and sustainable manufacturing processes.
UR - http://www.scopus.com/inward/record.url?scp=84856913387&partnerID=8YFLogxK
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U2 - 10.1149/1.3600743
DO - 10.1149/1.3600743
M3 - Conference contribution
AN - SCOPUS:84856913387
SN - 9781607682523
T3 - ECS Transactions
SP - 229
EP - 240
BT - 2011 International Conference on Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors, ULSIC vs. TFT
PB - Electrochemical Society Inc.
Y2 - 27 June 2011 through 1 July 2011
ER -