Finite element modeling of 3D interconnection structures

Jilin Tan, George Pan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Three dimensional interconnection structures are modeled by an edge based finite element method. The corresponding boundary conditions at the planes of incidence and transmittance for hybrid modes are derived. These conditions take into account both the transverse and longitudinal field components of the propagating signals. Employing these boundary conditions, in conjunction with the absorbing boundary conditions (ABC) and/or the boundary conditions of the first and third order, a 3D asymmetrical functional is implemented as a hybrid vector edge element method. Numerical examples are presented for air bridges, a through-hole via and a spiral inductor. The equivalent frequency dependent circuit parameters are then extracted from the field solutions. Laboratory measurements and data comparison with previous published results strongly support the newly developed theoretical work.

Original languageEnglish (US)
Title of host publicationICMMT 1998 - 1998 International Conference on Microwave and Millimeter Wave Technology, Proceedings
EditorsFu-Jiang Liao
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages957-960
Number of pages4
Volume1998-August
ISBN (Electronic)0780343085, 9780780343085
DOIs
StatePublished - Jan 1 1998
Externally publishedYes
Event1998 International Conference on Microwave and Millimeter Wave Technology, ICMMT 1998 - Beijing, China
Duration: Aug 18 1998Aug 20 1998

Other

Other1998 International Conference on Microwave and Millimeter Wave Technology, ICMMT 1998
CountryChina
CityBeijing
Period8/18/988/20/98

ASJC Scopus subject areas

  • Instrumentation
  • Computer Networks and Communications

Fingerprint Dive into the research topics of 'Finite element modeling of 3D interconnection structures'. Together they form a unique fingerprint.

  • Cite this

    Tan, J., & Pan, G. (1998). Finite element modeling of 3D interconnection structures. In F-J. Liao (Ed.), ICMMT 1998 - 1998 International Conference on Microwave and Millimeter Wave Technology, Proceedings (Vol. 1998-August, pp. 957-960). [768448] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICMMT.1998.768448